The LG Lancet is a low-end budget smartphone made by LG Electronics . It was first launched as a Windows Phone 8.1 device in July 2015 and was made available in an Android 5.1 version in October of that year. Both devices are available from Verizon Wireless .
34-411: The LG Lancet featured a 4.5-inch touchscreen display with a 854 x 480 pixel screen resolution. It was powered by a 1.2 GHz Qualcomm Snapdragon Quad-core Processor and ran on 2,100 mAh battery with 8 GB internal storage that could be expanded up to 128 GB. The device was criticized for the quality of photos taken by its 8-megapixel primary camera and a 0.3-megapixel front-facing camera. Verizon sold
68-417: A 720p resolution, 3D graphics and a 12-megapixel camera. By November 2008, 15 device manufacturers had embed Snapdragon chips in their consumer electronics products. In November 2008, Qualcomm announced it would also compete against Intel in the netbook processor market with dual-core Snapdragon system-on-chips planned for late 2009. It demonstrated a Snapdragon processor that consumed less power than
102-509: A Xenon processor fabricated in a 45 nm process. The PlayStation 3 Slim model introduced the Cell Broadband Engine in a 45 nm process. At IEDM 2007, more technical details of Intel's 45 nm process were revealed. Since immersion lithography is not used here, the lithographic patterning is more difficult. Hence, a line-cutting double patterning method is used explicitly for this 45 nm process. Also,
136-588: A common 45 nm process platform. At the end of 2008, SMIC was the first China-based semiconductor company to move to 45 nm, having licensed the bulk 45 nm process from IBM. In 2008, TSMC moved on to a 40 nm process. Many critical feature sizes are smaller than the wavelength of light used for lithography (i.e., 193 nm and 248 nm). A variety of techniques, such as larger lenses, are used to make sub-wavelength features. Double patterning has also been introduced to assist in shrinking distances between features, especially if dry lithography
170-852: A dominant market position for smartphones at the time and did not incorporate Snapdragon into any of its products. The success of Snapdragon therefore relied on competing Android phones. Support for the Windows Phone 7 operating systems was added to Snapdragon in October 2010. By 2011 Snapdragon was embedded in Hewlett Packard 's WebOS devices and had a 50% market share of a $ 7.9 billion smartphone processor market. As of July 2014 Qualcomm's Snapdragon chips were embedded in 41% of smartphones. Snapdragon chips are also used in Android-based smartwatches, and in vehicles like
204-441: A graphics processing unit (GPU), a global positioning system (GPS) and an (optional) cellular modem integrated into a single package. It has software included that operates graphics, video and picture-taking. The current Snapdragon naming scheme was implemented after the announcement of Snapdragon 800 family in 2013. Models prior to it were renamed to the 200, 400 or 600 series. The former two targeting entry-level products, while
238-635: Is the first Qualcomm SOC that is built on a 10 nm architecture. Qualcomm's new flagship chip for 2018, the 845, was announced in December 2017. According to Qualcomm, the 845 is 25-30% faster than the 835. In 2017 the 660 and 630 replaced the 653 and 626 mid-range models and several chips in the 400 product family were revised. In February 2017, Qualcomm introduced the Snapdragon X20 celluar modem, intended for 5G cell phone networks, and two new chips for 802.11ax commercial Wi-Fi networks. This
272-428: Is used. It is expected that more layers will be patterned with 193 nm wavelength at the 45 nm node. Moving previously loose layers (such as Metal 4 and Metal 5) from 248 nm to 193 nm wavelength is expected to continue, which will likely further drive costs upward, due to difficulties with 193 nm photoresists . Chipmakers have initially voiced concerns about introducing new high-κ materials into
306-463: The ARM architecture , a graphics processing unit (GPU), some digital signal processors (DSP), and may or may not include a cellular modem . Snapdragon semiconductors are designed for embedded systems , e.g., smartphones , netbooks , and vehicles. In addition to the processors, the lineup also includes modems, Wi-Fi chips and mobile charging products. The first Snapdragon-branded product, QSD8250,
340-532: The International Technology Roadmap for Semiconductors , the 45 nm process is a MOSFET technology node referring to the average half-pitch of a memory cell manufactured at around the 2007–2008 time frame. Matsushita and Intel started mass-producing 45 nm chips in late 2007, and AMD started production of 45 nm chips in late 2008, while IBM , Infineon , Samsung , and Chartered Semiconductor have already completed
374-696: The Maserati Quattroporte and Cadillac XTS . In June 2010, Qualcomm began sampling the third generation of Snapdragon products; two dual-core 1.2 GHz system on chips (SoC) called the Mobile Station Modem (MSM) 8260 and 8660. The 8260 was for GSM, UMTS and HSPA+ networks, while the 8660 was for CDMA2000 and EVDO networks. That November Qualcomm announced the MSM8960 for LTE networks. In early 2011, Qualcomm announced Krait, an in-house CPU microarchitecture design supporting
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#1732801358532408-880: The Xeon 5400 series, in November 2007. Many details about Penryn appeared at the April 2007 Intel Developer Forum . Its successor is called Nehalem . Important advances include the addition of new instructions (including SSE4 , also known as Penryn New Instructions) and new fabrication materials (most significantly a hafnium -based dielectric). Intel's 45nm process has a transistor density of 3.33 million transistors per square milimeter (MTr/mm2). AMD released its Sempron II , Athlon II , Turion II and Phenom II (in generally increasing order of performance), as well as Shanghai Opteron processors using 45 nm process technology in late 2008. The Xbox 360 S , released in 2010, has
442-732: The 600 and 800 targeting mid-range and high-end products, respectively. The Snapdragon 805 was released in November 2013. The 410, which is intended for low-cost phones in developing nations, was announced the following month. In January 2014, Qualcomm introduced a modified version of the Snapdragon 600 called 602A that is intended for in-car infotainment screens, backup cameras, and other driver assistance products. The quad-core Snapdragon 610 and eight-core 615 were announced in February 2014. The Snapdragon 808 and 810 were announced in April 2014. The Snapdragon 835, announced in November 2017,
476-451: The 810, which led to Samsung ditching Snapdragon for its Galaxy S6 flagship phone. The entry-level 200 series was expanded with six new processors using 28 nanometer manufacturing and dual or quad-core options in June 2013. In February 2015, Qualcomm re-branded its stand-alone modem products under the Snapdragon name; they were distinguished from SoCs using the "x" designation, such as
510-481: The ARM v7 instruction set. SoCs featuring Krait were named S4 supports asynchronous symmetrical multi-processing (aSMP), meaning each processor core adjusted its clock speed and voltage based on the device's activity in order to optimize battery usage. Prior models were renamed to S1, S2 and S3 to distinguish between each generation. The S4-based generation of Snapdragon SoCs began shipping to product manufacturers with
544-567: The GPU floating point performance. Snapdragon is to be the primary shirt sponsor for English football club Manchester United starting with the 2024–25 season, replacing the German company TeamViewer . The brand also holds naming rights for Snapdragon Stadium in San Diego . The stadium will host San Diego FC of Major League Soccer (MLS) starting in 2025. 45 nm process Per
578-641: The Lancet for $ 120 off-contract and $ 69.99 on-contract. It was part of the three Windows devices sold during the period with the other two being the high-end HTC One (M8) and the mid-range Lumia 735 . This technology-related article is a stub . You can help Misplaced Pages by expanding it . Qualcomm Snapdragon Snapdragon is a suite of system-on-chip (SoC) semiconductor products for mobile devices designed and marketed by Qualcomm , who often refers to these SoCs as "mobile platforms". They typically integrate central processing units (CPU) based on
612-464: The MSM8960 in February 2012. In benchmark tests by Anandtech , the MSM8960 had better performance than any other processor tested. In an overall system benchmark, the 8960 obtained a score of 907, compared to 528 and 658 for the Galaxy Nexus and HTC Rezound respectively. In a Quadrant benchmark test, which assesses raw processing power, a dual-core Krait processor had a score of 4,952, whereas
646-728: The QSD8650A released in November 2009. By 2009, some smartphone models with Snapdragon SoCs integrated include the Acer Liquid Metal , HTC HD2 , Toshiba TG01 and the Sony Ericsson Xperia X10 . Lenovo announced the first netbook product using Snapdragon SoCs that December. According to PC World , mobile devices using Snapdragon had longer battery life and were smaller in size than those using other SoCs. By June 2010, Snapdragon chips were incorporated into 120 product designs in development. Apple had
680-428: The Snapdragon 835. Snapdragon 845 uses updated Cortex-A75 and A55 CPU, and the same 10-nanometer manufacturing process as 835. The 7 series is introduced in early 2018, targeting pricing and performances between the 6 and 8 series. As of 2018, Asus , HP and Lenovo have begun selling laptops with Snapdragon-based CPUs running Windows 10 on ARM under the name " Always Connected PCs ". The Snapdragon 855
714-471: The Snapdragon S4 (Krait core) had taken a dominant share from other Android system-on-chips like Nvidia Tegra and Texas Instruments OMAP which caused the latter to exit the market. As of July 2014, the market share of Android phones had grown to 84.6 percent, and Qualcomm's Snapdragon chips powered 41% of smartphones. Snapdragon SoCs are also used in most Windows phones and most phones entering
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#1732801358532748-525: The Snapdragon product suite. Early versions of Scorpion had a processor core design similar to the Cortex-A8 . The first Snapdragon shipments were of the QSD8250 in November 2007. According to CNET, Snapdragon's claim to fame was having the first 1 GHz made-for-mobile processor. Most smartphones at the time were using 500 MHz processors. The first generation of Snapdragon products supported
782-536: The Snapdragon software development kit (SDK) for Android devices at the Uplinq developer conference. The SDK includes tools for facial recognition, gesture recognition, noise cancellation and audio recording. That November Qualcomm acquired some assets from EPOS Development in order to integrate its stylus and gesture recognition technology into Snapdragon products. It also collaborated with Microsoft to optimize Windows Phone 8 for Snapdragon semiconductors. By 2012,
816-565: The X50, was announced in October 2016 and released in late 2019. The octa-core Snapdragon 835 SoC is announced on 17 November 2016. It uses modified Cortex-A73 and A53 cores and is built using Samsung's 10 nanometer FinFET process. At Computex 2017 in May, Qualcomm and Microsoft announced plans to launch Snapdragon-based laptops running Windows 10 . Qualcomm partnered with HP , Lenovo, and Asus to release slim portables and 2-in-1 devices powered by
850-591: The X7 or X12 modem. In early 2016, Qualcomm launched the Snapdragon 820 , an ARM 64-bit quad-core processor using in-house designed Kryo cores. A higher clocked variant is available as the Snapdragon 821. The SoC uses Samsung 's 14-nanometer FinFET process . Together released is the Neural Processing Engine SDK supporting AI acceleration . The first Snapdragon modem for 5G networks,
884-428: The contemporary Intel Atom Z500 , and claimed it would also cost less when released. That same month, Qualcomm introduced a Snapdragon-based prototype netbook called Kayak that used 1.5 GHz processors and was intended for developing markets. In collaboration with Sun , Java SE received Snapdragon-specific optimizations in May 2009. Qualcomm also started using 45nm process for SoC productions, like with
918-654: The gate stack, for the purpose of reducing leakage current density. As of 2007, however, both IBM and Intel have announced that they have high-κ dielectric and metal gate solutions, which Intel considers to be a fundamental change in transistor design. NEC has also put high-κ materials into production. The successors to 45 nm technology are 32 nm , 22 nm , and then 14 nm technologies. Matsushita Electric Industrial Co. started mass production of system-on-a-chip (SoC) ICs for digital consumer equipment based on 45 nm process technology in June 2007. Intel shipped its first 45 nm processor,
952-457: The market in mid-2013. The September 2013 debut of Apple's 64-bit A7 chip in the iPhone 5S forced Qualcomm to rush out a competing 64-bit solution, despite the capable performance of the Snapdragon 800/801/805, since their existing Krait cores were only 32-bit. The first 64-bit SoCs, the Snapdragon 808 and 810 , were rushed to market using generic Cortex-A57 and Cortex-A53 cores and suffered from overheating problems and throttling, particularly
986-622: The quad-core Tegra 3 was just under 4,000. The quad-core version, APQ8064, was made available in July 2012. It was the first Snapdragon SoC to use Qualcomm's Adreno 320 graphics processing unit (GPU). Adoption of Snapdragon contributed to Qualcomm's transition from a wireless modem company to one that also produces a wider range of hardware and software for mobile devices. In July 2011 Qualcomm acquired certain assets from GestureTek in order to incorporate its gesture recognition intellectual property into Snapdragon SoCs. In mid-2012 Qualcomm announced
1020-414: The use of high-κ dielectric dielectrics is introduced for the first time, to address gate leakage issues. For the 32 nm node, immersion lithography will begin to be used by Intel. In a 2008 Chipworks reverse-engineering, it was disclosed that the trench contacts were formed as a "Metal-0" layer in tungsten serving as a local interconnect. Most trench contacts were short lines oriented parallel to
1054-699: Was developing the Scorpion central processing unit (CPU) in November 2007. The Snapdragon system on chip (SoC) was announced in November 2006 and included the Scorpion processor, as well as other semiconductors. This also included Qualcomm's first custom Hexagon digital signal processor (DSP). According to a Qualcomm spokesperson, it was named Snapdragon, because "Snap and Dragon sounded fast and fierce." The following month, Qualcomm acquired Airgo Networks for an undisclosed amount; it said Airgo's 802.11a/b/g and 802.11n Wi-Fi technology would be integrated with
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1088-399: Was followed by the addition of the 636 to the 600 product family that October, which Qualcomm said would be 40 percent faster than the 630. The 8cx series are SoCs designed for Windows laptops. The first generation 8cx featured two CPU clusters consisting of four Cortex-A76 and A55 CPU cores, respectively. Compared to the comtemporary 855, the first 8cx has a larger 10MB L3 cache and double
1122-526: Was released in 2019 and built on TSMC 's 7 nanometer process. The Snapdragon 865 supported 5G celluar network through a separate X55 modem. The 765 has integrated 5G. The Snapdragon 888 announced in December 2020 is the first Qualcomm SoC to feature ARM's Cortex-X series CPU architecure. NASA's Ingenuity helicopter , which landed on Mars in 2021, has a Snapdragon 801 processor integrated onboard. The Snapdragon 8 Gen 2 added support for Wi-Fi 7 . Snapdragon system on chip products typically include
1156-417: Was released in December 2007. The "Krait" microarchitecture was introduced in 2011, allowing each processor core to adjust its speed based on the device's needs. The Snapdragon 800 series was introduced at the 2013 Consumer Electronics Show , and prior models were renamed as the 200, 400 and 600 series. Qualcomm re-branded its modem products under the Snapdragon name in February 2015. Qualcomm announced it
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