Misplaced Pages

#586413

106-422: The Magic Trackpad is a multi-touch and force touch trackpad produced by Apple Inc. The first generation version was released on July 27, 2010, and featured a trackpad 80% larger than the built-in trackpad found on the then-current MacBook family of laptops. A redesigned second generation version, initially marketed as Magic Trackpad 2 , was released on October 13, 2015. The first generation Magic Trackpad

212-488: A technology node or process node , designated by the process' minimum feature size in nanometers (or historically micrometers ) of the process's transistor gate length, such as the " 90 nm process ". However, this has not been the case since 1994, and the number of nanometers used to name process nodes (see the International Technology Roadmap for Semiconductors ) has become more of

318-508: A wafer , typically made of pure single-crystal semiconducting material. Silicon is almost always used, but various compound semiconductors are used for specialized applications. The fabrication process is performed in highly specialized semiconductor fabrication plants , also called foundries or "fabs", with the central part being the " clean room ". In more advanced semiconductor devices, such as modern 14 / 10 / 7 nm nodes, fabrication can take up to 15 weeks, with 11–13 weeks being

424-474: A "tap-click" gesture to select while maintaining location with another finger are also described. In 1991, Pierre Wellner advanced the topic publishing about his multi-touch "Digital Desk", which supported multi-finger and pinching motions. Various companies expanded upon these inventions in the beginning of the twenty-first century. Between 1999 and 2005, the company Fingerworks developed various multi-touch technologies, including Touchstream keyboards and

530-530: A 20   μm process before gradually scaling to a 10 μm process over the next several years. Many early semiconductor device manufacturers developed and built their own equipment such as ion implanters. In 1963, Harold M. Manasevit was the first to document epitaxial growth of silicon on sapphire while working at the Autonetics division of North American Aviation (now Boeing ). In 1964, he published his findings with colleague William Simpson in

636-412: A capacitive touch screen with a fixed number of programmable buttons presented on a display. The screen was to consist of a set of capacitors etched into a film of copper on a sheet of glass, each capacitor being constructed so that a nearby flat conductor, such as the surface of a finger, would increase the capacitance by a significant amount. The capacitors were to consist of fine lines etched in copper on

742-558: A device similar to the Microsoft Surface was shown. It took up an executive's entire desk and was used to communicate with the Master Control computer . In the 2002 film Minority Report , Tom Cruise uses a set of gloves that resemble a multi-touch interface to browse through information. In the 2005 film The Island , another form of a multi-touch computer was seen where the professor, played by Sean Bean , has

848-422: A finger or an object touches the surface, causing the light to scatter, the reflection of which is caught with sensors or cameras that send the data to software that dictates response to the touch, depending on the type of reflection measured. Optical technologies include: Acoustic and radio-frequency wave-based technologies include: Multi-touch touchscreen gestures enable predefined motions to interact with

954-481: A marketing term that has no standardized relation with functional feature sizes or with transistor density (number of transistors per unit area). Initially transistor gate length was smaller than that suggested by the process node name (e.g. 350 nm node); however this trend reversed in 2009. Feature sizes can have no connection to the nanometers (nm) used in marketing. For example, Intel's former 10 nm process actually has features (the tips of FinFET fins) with

1060-399: A means of information or exhibit display. Multi-touch has been implemented in several different ways, depending on the size and type of interface. The most popular form are mobile devices, tablets , touchtables and walls. Both touchtables and touch walls project an image through acrylic or glass, and then back-light the image with LEDs. Touch surfaces can also be made pressure-sensitive by

1166-436: A multi-touch desktop to organize files, based on an early version of Microsoft Surface (not be confused with the tablet computers which now bear that name). In 2007, the television series CSI: Miami introduced both surface and wall multi-touch displays in its sixth season. Multi-touch technology can be seen in the 2008 James Bond film Quantum of Solace , where MI6 uses a touch interface to browse information about

SECTION 10

#1732791302587

1272-419: A response to the gesture event. In the past few years, several companies have released products that use multi-touch. In an attempt to make the expensive technology more accessible, hobbyists have also published methods of constructing DIY touchscreens. Capacitive technologies include: Resistive technologies include: Optical touch technology is based on image sensor technology. It functions when

1378-543: A semiconductor device might not need all techniques. Equipment for carrying out these processes is made by a handful of companies . All equipment needs to be tested before a semiconductor fabrication plant is started. These processes are done after integrated circuit design . A semiconductor fab operates 24/7 and many fabs use large amounts of water, primarily for rinsing the chips. Additionally steps such as Wright etch may be carried out. When feature widths were far greater than about 10 micrometres , semiconductor purity

1484-419: A semiconductor fabrication facility are required to wear cleanroom suits to protect the devices from contamination by humans. To increase yield, FOUPs and semiconductor capital equipment may have a mini environment with ISO class 1 level of dust, and FOUPs can have an even cleaner micro environment. FOUPs and SMIF pods isolate the wafers from the air in the cleanroom, increasing yield because they reduce

1590-418: A semiconductor manufacturing process. Many semiconductor devices are designed in sections called cells, and each cell represents a small part of the device such as a memory cell to store data. Thus F is used to measure the area taken up by these cells or sections. A specific semiconductor process has specific rules on the minimum size (width or CD/Critical Dimension) and spacing for features on each layer of

1696-414: A sheet of glass – fine enough (80 μm) and sufficiently far apart (80 μm) to be invisible. In the final device, a simple lacquer coating prevented the fingers from actually touching the capacitors. In the same year, MIT described a keyboard with variable graphics capable of multi-touch detection. In the early 1980s, The University of Toronto 's Input Research Group were among the earliest to explore

1802-587: A shift key while typing another were not possible. Exceptions to these were a "cross-wire" multi-touch reconfigurable touchscreen keyboard/display developed at the Massachusetts Institute of Technology in the early 1970s and the 16 button capacitive multi-touch screen developed at CERN in 1972 for the controls of the Super Proton Synchrotron that were under construction. In 1976 a new x-y capacitive screen, based on

1908-472: A wafer box or a wafer carrying box. In semiconductor device fabrication, the various processing steps fall into four general categories: deposition, removal, patterning, and modification of electrical properties. Modification of electrical properties now also extends to the reduction of a material's dielectric constant in low-κ insulators via exposure to ultraviolet light in UV processing (UVP). Modification

2014-408: A wafer will be processed by a particular machine in a processing step during manufacturing. Process variability is a challenge in semiconductor processing, in which wafers are not processed evenly or the quality or effectiveness of processes carried out on a wafer are not even across the wafer surface. Wafer processing is separated into FEOL and BEOL stages. FEOL processing refers to the formation of

2120-587: A width of 7 nm, so the Intel 10 nm process is similar in transistor density to TSMC 's 7 nm process . As another example, GlobalFoundries' 12 and 14 nm processes have similar feature sizes. In 1955, Carl Frosch and Lincoln Derick, working at Bell Telephone Laboratories , accidentally grew a layer of silicon dioxide over the silicon wafer, for which they observed surface passivation effects. By 1957 Frosch and Derick, using masking and predeposition, were able to manufacture silicon dioxide transistors;

2226-467: Is optical touch technology , based on image sensor technology. In computing , multi-touch is technology which enables a touchpad or touchscreen to recognize more than one or more than two points of contact with the surface. Apple popularized the term "multi-touch" in 2007 with which it implemented additional functionality, such as pinch to zoom or to activate certain subroutines attached to predefined gestures . The two different uses of

SECTION 20

#1732791302587

2332-460: Is attached to the touch surface. Usually, separate companies make the ASIC and screen that combine into a touch screen; conversely, a touchpad's surface and ASIC are usually manufactured by the same company. There have been large companies in recent years that have expanded into the growing multi-touch industry, with systems designed for everything from the casual user to multinational organizations. It

2438-788: Is deposited. Once the epitaxial silicon is deposited, the crystal lattice becomes stretched somewhat, resulting in improved electronic mobility. Another method, called silicon on insulator technology involves the insertion of an insulating layer between the raw silicon wafer and the thin layer of subsequent silicon epitaxy. This method results in the creation of transistors with reduced parasitic effects . Semiconductor equipment may have several chambers which process wafers in processes such as deposition and etching. Many pieces of equipment handle wafers between these chambers in an internal nitrogen or vacuum environment to improve process control. Wet benches with tanks containing chemical solutions were historically used for cleaning and etching wafers. At

2544-401: Is determined by the width of the smallest lines that can be patterned in a semiconductor fabrication process, this measurement is known as the linewidth. Patterning often refers to photolithography which allows a device design or pattern to be defined on the device during fabrication. F is used as a measurement of area for different parts of a semiconductor device, based on the feature size of

2650-403: Is frequently achieved by oxidation , which can be carried out to create semiconductor-insulator junctions, such as in the local oxidation of silicon ( LOCOS ) to fabricate metal oxide field effect transistors . Modern chips have up to eleven or more metal levels produced in over 300 or more sequenced processing steps. A recipe in semiconductor manufacturing is a list of conditions under which

2756-466: Is now common for laptop manufacturers to include multi-touch touchpads on their laptops, and tablet computers respond to touch input rather than traditional stylus input and it is supported by many recent operating systems . A few companies are focusing on large-scale surface computing rather than personal electronics, either large multi-touch tables or wall surfaces. These systems are generally used by government organizations, museums, and companies as

2862-407: Is often based on tungsten and has upper and lower layers: the lower layer connects the junctions of the transistors, and an upper layer which is a tungsten plug that connects the transistors to the interconnect. Intel at the 10nm node introduced contact-over-active-gate (COAG) which, instead of placing the contact for connecting the transistor close to the gate of the transistor, places it directly over

2968-425: Is reduced and the users' hands don't obstruct the display. Instead of placing windows all over the screen, the windowing manager, Con10uum, uses a linear paradigm, with multi-touch used to navigate between and arrange the windows. An area at the right side of the touch screen brings up a global context menu, and a similar strip at the left side brings up application-specific menus. An open source community preview of

3074-666: Is seated or the floorpad on which the user is standing. In 2007, NORTD labs open source system offered its CUBIT (multi-touch) . Small-scale touch devices rapidly became commonplace in 2008. The number of touch screen telephones was expected to increase from 200,000 shipped in 2006 to 21 million in 2012. In May 2015, Apple was granted a patent for a "fusion keyboard", which turns individual physical keys into multi-touch buttons. Apple has retailed and distributed numerous products using multi-touch technology, most prominently including its iPhone smartphone and iPad tablet. Additionally, Apple also holds several patents related to

3180-424: Is shown to be performing multiple multi-touch hand gestures on a large touch wall. In the 2009, the film District 9 the interface used to control the alien ship features similar technology. 10/GUI is a proposed new user interface paradigm. Created in 2009 by R. Clayton Miller, it combines multi-touch input with a new windowing manager . It splits the touch surface away from the screen, so that user fatigue

3286-472: Is the amount of working devices on a wafer. This mini environment is within an EFEM (equipment front end module) which allows a machine to receive FOUPs, and introduces wafers from the FOUPs into the machine. Additionally many machines also handle wafers in clean nitrogen or vacuum environments to reduce contamination and improve process control. Fabrication plants need large amounts of liquid nitrogen to maintain

Magic Trackpad - Misplaced Pages Continue

3392-562: Is the same height and angle of inclination as the Apple Wireless Keyboard, making them a good fit, in terms of size and style." In reviews of the second-generation Magic Trackpad, reviewers praised the new Force Touch functionality, better ergonomics over the Magic Mouse, and full compatibility with macOS and iPadOS, but noted its high price tag. Multi-touch Several uses of the term multi-touch resulted from

3498-586: The Czochralski process . These ingots are then sliced into wafers about 0.75 mm thick and polished to obtain a very regular and flat surface. During the production process wafers are often grouped into lots, which are represented by a FOUP, SMIF or a wafer cassette, which are wafer carriers. FOUPs and SMIFs can be transported in the fab between machines and equipment with an automated OHT (Overhead Hoist Transport) AMHS (Automated Material Handling System). Besides SMIFs and FOUPs, wafer cassettes can be placed in

3604-514: The High-κ dielectric , creating dummy gates, manufacturing sources and drains by ion deposition and dopant annealing, depositing an "interlevel dielectric (ILD)" and then polishing, and removing the dummy gates to replace them with a metal whose workfunction depended on whether the transistor was NMOS or PMOS, thus creating the metal gate. A third process, full silicidation (FUSI) was not pursued due to manufacturing problems. Gate-first became dominant at

3710-674: The Journal of Applied Physics . In 1965, C.W. Mueller and P.H. Robinson fabricated a MOSFET (metal–oxide–semiconductor field-effect transistor) using the silicon-on-sapphire process at RCA Laboratories . Semiconductor device manufacturing has since spread from Texas and California in the 1960s to the rest of the world, including Asia , Europe , and the Middle East . Wafer size has grown over time, from 25 mm in 1960, to 50 mm in 1969, 100 mm in 1976, 125 mm in 1981, 150 mm in 1983 and 200 mm in 1992. In

3816-600: The Lightning connector for charging and pairing. Released in 2020, iPadOS 13.4 introduced mouse support to iPads for the first time, and supports all functionality of the second-generation Magic Trackpad. It was originally released in white, and was followed by a space gray version that was introduced with the iMac Pro in 2017 alongside a color-matching Magic Keyboard ; both were later made available as standalone purchases. Seven pastel models (red, pink, orange, yellow, green, blue, and purple) were introduced in 2021 to match

3922-505: The planar process in 1959 while at Fairchild Semiconductor . In 1948, Bardeen patented an insulated-gate transistor (IGFET) with an inversion layer, Bardeen's concept, forms the basis of CMOS technology today. An improved type of MOSFET technology, CMOS , was developed by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in 1963. CMOS was commercialised by RCA in the late 1960s. RCA commercially used CMOS for its 4000-series integrated circuits in 1968, starting with

4028-429: The transistors directly in the silicon . The raw wafer is engineered by the growth of an ultrapure, virtually defect-free silicon layer through epitaxy . In the most advanced logic devices , prior to the silicon epitaxy step, tricks are performed to improve the performance of the transistors to be built. One method involves introducing a straining step wherein a silicon variant such as silicon-germanium (SiGe)

4134-437: The 1970s. High-k dielectric such as hafnium oxide (HfO 2 ) replaced silicon oxynitride (SiON), in order to prevent large amounts of leakage current in the transistor while allowing for continued scaling or shrinking of the transistors. However HfO 2 is not compatible with polysilicon gates which requires the use of a metal gate. Two approaches were used in production: gate-first and gate-last. Gate-first consists of depositing

4240-414: The 22nm node, because planar transistors which only have one surface acting as a channel, started to suffer from short channel effects. A startup called SuVolta created a technology called Deeply Depleted Channel (DDC) to compete with FinFET transistors, which uses planar transistors at the 65 nm node which are very lightly doped. By 2018, a number of transistor architectures had been proposed for

4346-601: The 22nm/20nm node. HKMG has been extended from planar transistors for use in FinFET and nanosheet transistors. Hafnium silicon oxynitride can also be used instead of Hafnium oxide. Since the 16nm/14nm node, Atomic layer etching (ALE) is increasingly used for etching as it offers higher precision than other etching methods. In production, plasma ALE is commonly used, which removes materials unidirectionally, creating structures with vertical walls. Thermal ALE can also be used to remove materials isotropically, in all directions at

Magic Trackpad - Misplaced Pages Continue

4452-463: The 350nm and 250nm nodes (0.35 and 0.25 micron nodes), at the same time chemical mechanical polishing began to be employed. At the time, 2 metal layers for interconnect, also called metallization was state-of-the-art. Since the 22nm node, some manufacturers have added a new process called middle-of-line (MOL) which connects the transistors to the rest of the interconnect made in the BEoL process. The MOL

4558-537: The 90nm node, transistor channels made with strain engineering were introduced to improve drive current in PMOS transistors by introducing regions with Silicon-Germanium in the transistor. The same was done in NMOS transistors at the 20nm node. In 2007, HKMG (high-k/metal gate) transistors were introduced by Intel at the 45nm node, which replaced polysilicon gates which in turn replaced metal gate (aluminum gate) technology in

4664-512: The CMU system was optical. In 1985, the canonical multitouch pinch-to-zoom gesture was demonstrated, with coordinated graphics, on CMU's system. In October 1985, Steve Jobs signed a non-disclosure agreement to tour CMU's Sensor Frame multi-touch lab. In 1990, Sears et al. published a review of academic research on single and multi-touch touchscreen human–computer interaction of the time, describing single touch gestures such as rotating knobs, swiping

4770-680: The Con10uum window manager was made available in November, 2009. Semiconductor device fabrication Semiconductor device fabrication is the process used to manufacture semiconductor devices , typically integrated circuits (ICs) such as computer processors , microcontrollers , and memory chips (such as RAM and Flash memory ). It is a multiple-step photolithographic and physico-chemical process (with steps such as thermal oxidation , thin-film deposition, ion-implantation, etching) during which electronic circuits are gradually created on

4876-664: The Magic Trackpad 2, was released on October 13, 2015, alongside the Magic Keyboard and Magic Mouse 2 . It had 29% more surface area than the first generation model, features an enclosed wedge design, and adds support for Force Touch . It also provides haptic feedback via Apple's built-in Taptic Engine that is also used in MacBook trackpads. It includes a built-in rechargeable lithium-ion battery and uses

4982-497: The Precision 5000. Until the 1980s, physical vapor deposition was the primary technique used for depositing materials onto wafers, until the advent of chemical vapor deposition. Equipment with diffusion pumps was replaced with those using turbomolecular pumps as the latter do not use oil which often contaminated wafers during processing in vacuum. 200 mm diameter wafers were first used in 1990 for making chips. These became

5088-511: The Producer, a cluster tool that had chambers grouped in pairs for processing wafers, which shared common vacuum and supply lines but were otherwise isolated, which was revolutionary at the time as it offered higher productivity than other cluster tools without sacrificing quality, due to the isolated chamber design. The semiconductor industry is a global business today. The leading semiconductor manufacturers typically have facilities all over

5194-433: The U.S. Patent and Trademark office declared that the "pinch-to-zoom" functionality was predicted by U.S. Patent # 7,844,915 relating to gestures on touch screens, filed by Bran Ferren and Daniel Hillis in 2005, as was inertial scrolling, thus invalidated a key claims of Apple's patent. In 2001, Microsoft's table-top touch platform, Microsoft PixelSense (formerly Surface) started development, which interacts with both

5300-405: The addition of a pressure-sensitive coating that flexes differently depending on how firmly it is pressed, altering the reflection. Handheld technologies use a panel that carries an electrical charge. When a finger touches the screen, the touch disrupts the panel's electrical field. The disruption is registered as a computer event (gesture) and may be sent to the software, which may then initiate

5406-530: The adoption of FOUPs, but many products that are not advanced are still produced in 200 mm wafers such as analog ICs, RF chips, power ICs, BCDMOS and MEMS devices. Some processes such as cleaning, ion implantation, etching, annealing and oxidation started to adopt single wafer processing instead of batch wafer processing in order to improve the reproducibility of results. A similar trend existed in MEMS manufacturing. In 1998, Applied Materials introduced

SECTION 50

#1732791302587

5512-400: The air in the cleanroom; semiconductor capital equipment may also have their own FFUs to clean air in the equipment's EFEM which allows the equipment to receive wafers in FOUPs. The FFUs, combined with raised floors with grills, help ensure a laminar air flow, to ensure that particles are immediately brought down to the floor and do not stay suspended in the air due to turbulence. The workers in

5618-547: The atmosphere inside production machinery and FOUPs, which are constantly purged with nitrogen. There can also be an air curtain or a mesh between the FOUP and the EFEM which helps reduce the amount of humidity that enters the FOUP and improves yield. Companies that manufacture machines used in the industrial semiconductor fabrication process include ASML , Applied Materials , Tokyo Electron and Lam Research . Feature size

5724-544: The average utilization of semiconductor devices increased, durability became an issue and manufacturers started to design their devices to ensure they last for enough time, and this depends on the market the device is designed for. This especially became a problem at the 10 nm node. Silicon on insulator (SOI) technology has been used in AMD 's 130 nm, 90 nm, 65 nm, 45 nm and 32 nm single, dual, quad, six and eight core processors made since 2001. During

5830-506: The capacitance touch screens developed in 1972 by Danish electronics engineer Bent Stumpe , was developed at CERN . This technology, allowing an exact location of the different touch points, was used to develop a new type of human machine interface (HMI) for the control room of the Super Proton Synchrotron particle accelerator. In a handwritten note dated 11 March 1972, Stumpe presented his proposed solution –

5936-400: The carrier, processed and returned to the carrier, so acid-resistant carriers were developed to eliminate this time consuming process, so the entire cassette with wafers was dipped into wet etching and wet cleaning tanks. When wafer sizes increased to 100 mm, the entire cassette would often not be dipped as uniformly, and the quality of the results across the wafer became hard to control. By

6042-499: The chip. Normally a new semiconductor process has smaller minimum sizes and tighter spacing. In some cases, this allows a simple die shrink of a currently produced chip design to reduce costs, improve performance, and increase transistor density (number of transistors per unit area) without the expense of a new design. Early semiconductor processes had arbitrary names for generations (viz., HMOS I/II/III/IV and CHMOS III/III-E/IV/V). Later each new generation process became known as

6148-519: The colors of the M1 iMac . Additionally, standalone purchases included a USB-C to Lightning cable instead of a USB-A cable. In 2022, the space gray color was replaced by a black-and-silver version which was previously only available bundled with the third-generation Mac Pro . On October 28, 2024, Apple released an updated Magic Trackpad that replaced the Lightning charging port with a USB-C port. Reviews of

6254-476: The company's financial abilities. From 2020 to 2022, there was a global chip shortage . During this shortage caused by the COVID-19 pandemic, many semiconductor manufacturers banned employees from leaving company grounds. Many countries granted subsidies to semiconductor companies for building new fabrication plants or fabs. Many companies were affected by counterfeit chips. Semiconductors have become vital to

6360-492: The criminal Dominic Greene. In the 2008 film The Day the Earth Stood Still , Microsoft's Surface was used. The television series NCIS: Los Angeles , which premiered 2009, makes use of multi-touch surfaces and wall panels as an initiative to go digital. In a 2008, an episode of the television series The Simpsons , Lisa Simpson travels to the underwater headquarters of Mapple to visit Steve Mobbs, who

6466-502: The depth of focus of available lithography, and thus interfering with the ability to pattern. CMP ( chemical-mechanical planarization ) is the primary processing method to achieve such planarization, although dry etch back is still sometimes employed when the number of interconnect levels is no more than three. Copper interconnects use an electrically conductive barrier layer to prevent the copper from diffusing into ("poisoning") its surroundings, often made of tantalum nitride. In 1997, IBM

SECTION 60

#1732791302587

6572-424: The desired complementary electrical properties. In dynamic random-access memory (DRAM) devices, storage capacitors are also fabricated at this time, typically stacked above the access transistor (the now defunct DRAM manufacturer Qimonda implemented these capacitors with trenches etched deep into the silicon surface). Once the various semiconductor devices have been created , they must be interconnected to form

6678-746: The desired electrical circuits. This occurs in a series of wafer processing steps collectively referred to as BEOL (not to be confused with back end of chip fabrication, which refers to the packaging and testing stages). BEOL processing involves creating metal interconnecting wires that are isolated by dielectric layers. The insulating material has traditionally been a form of SiO 2 or a silicate glass , but recently new low dielectric constant materials, also called low-κ dielectrics, are being used (such as silicon oxycarbide), typically providing dielectric constants around 2.7 (compared to 3.82 for SiO 2 ), although materials with constants as low as 2.2 are being offered to chipmakers. BEoL has been used since 1995 at

6784-482: The device and software. An increasing number of devices like smartphones , tablet computers , laptops or desktop computers have functions that are triggered by multi-touch gestures. Years before it was a viable consumer product, popular culture portrayed potential uses of multi-touch technology in the future, including in several installments of the Star Trek franchise. In the 1982 Disney sci-fi film Tron

6890-477: The display. In January 2007, multi-touch technology became mainstream with the iPhone , and in its iPhone announcement Apple even stated it "invented multi touch", however both the function and the term predate the announcement or patent requests, except for the area of capacitive mobile screens, which did not exist before Fingerworks/Apple's technology (Fingerworks filed patents in 2001–2005, subsequent multi-touch refinements were patented by Apple ). However,

6996-411: The entire wafer is scrapped to avoid the costs of further processing. Virtual metrology has been used to predict wafer properties based on statistical methods without performing the physical measurement itself. Once the front-end process has been completed, the semiconductor devices or chips are subjected to a variety of electrical tests to determine if they function properly. The percent of devices on

7102-413: The era of 2 inch wafers, these were handled manually using tweezers and held manually for the time required for a given process. Tweezers were replaced by vacuum wands as they generate fewer particles which can contaminate the wafers. Wafer carriers or cassettes, which can hold several wafers at once, were developed to carry several wafers between process steps, but wafers had to be individually removed from

7208-605: The eventual replacement of FinFET , most of which were based on the concept of GAAFET : horizontal and vertical nanowires, horizontal nanosheet transistors (Samsung MBCFET, Intel Nanoribbon), vertical FET (VFET) and other vertical transistors, complementary FET (CFET), stacked FET, vertical TFETs, FinFETs with III-V semiconductor materials (III-V FinFET), several kinds of horizontal gate-all-around transistors such as nano-ring, hexagonal wire, square wire, and round wire gate-all-around transistors and negative-capacitance FET (NC-FET) which uses drastically different materials. FD-SOI

7314-437: The first automatic reticle and photomask inspection tool. In 1985, KLA developed an automatic inspection tool for silicon wafers, which replaced manual microscope inspection. In 1985, SGS (now STmicroelectronics ) invented BCD, also called BCDMOS , a semiconductor manufacturing process using bipolar , CMOS and DMOS devices. Applied Materials developed the first practical multi chamber, or cluster wafer processing tool,

7420-486: The first generation Magic Trackpad lauded its design but criticized its price. Scott Stein of CNET wrote, "Apple's $ 69 Bluetooth device is minimalist and not particularly cheap"; "We're not sure we'd ditch our mouse and use the Magic Trackpad, but it's a compact solution for the touch-addicted." Macworld also praised the trackpad's design similarity with the Apple Wireless Keyboard: "The Magic Trackpad

7526-525: The first planar field effect transistors, in which drain and source were adjacent at the same surface. At Bell Labs, the importance of their discoveries was immediately realized. Memos describing the results of their work circulated around Bell Labs before being formally published in 1957. At Shockley Semiconductor , Shockley had circulated the preprint of their article in December 1956 to all his senior staff, including Jean Hoerni , who would later invent

7632-459: The first touch screens in the late 1960s. In 1972, Control Data released the PLATO IV computer, an infrared terminal used for educational purposes, which employed single-touch points in a 16×16 array user interface. These early touchscreens only registered one point of touch at a time. On-screen keyboards (a well-known feature today) were thus awkward to use, because key-rollover and holding down

7738-438: The gate of the transistor to improve transistor density. Historically, the metal wires have been composed of aluminum . In this approach to wiring (often called subtractive aluminum ), blanket films of aluminum are deposited first, patterned, and then etched, leaving isolated wires. Dielectric material is then deposited over the exposed wires. The various metal layers are interconnected by etching holes (called " vias") in

7844-403: The high-k dielectric and then the gate metal such as Tantalum nitride whose workfunction depends on whether the transistor is NMOS or PMOS, polysilicon deposition, gate line patterning, source and drain ion implantation, dopant anneal, and silicidation of the polysilicon and the source and drain. In DRAM memories this technology was first adopted in 2015. Gate-last consisted of first depositing

7950-548: The iGesture Pad. in the early 2000s Alan Hedge , professor of human factors and ergonomics at Cornell University published several studies about this technology. In 2005, Apple acquired Fingerworks and its multi-touch technology. In 2004, French start-up JazzMutant developed the Lemur Input Device , a music controller that became in 2005 the first commercial product to feature a proprietary transparent multi-touch screen, allowing direct, ten-finger manipulation on

8056-537: The implementation of multi-touch in user interfaces, however the legitimacy of some patents has been disputed. Apple additionally attempted to register "Multi-touch" as a trademark in the United States—however its request was denied by the United States Patent and Trademark Office because it considered the term generic . Multi-touch sensing and processing occurs via an ASIC sensor that

8162-523: The industry average. Production in advanced fabrication facilities is completely automated, with automated material handling systems taking care of the transport of wafers from machine to machine. A wafer often has several integrated circuits which are called dies as they are pieces diced from a single wafer. Individual dies are separated from a finished wafer in a process called die singulation , also called wafer dicing. The dies can then undergo further assembly and packaging. Within fabrication plants,

8268-412: The insulating material and then depositing tungsten in them with a CVD technique using tungsten hexafluoride ; this approach can still be (and often is) used in the fabrication of many memory chips such as dynamic random-access memory (DRAM), because the number of interconnect levels can be small (no more than four). The aluminum was sometimes alloyed with copper for preventing recrystallization. Gold

8374-423: The interconnect (from silicon dioxides to newer low-κ insulators). This performance enhancement also comes at a reduced cost via damascene processing, which eliminates processing steps. As the number of interconnect levels increases, planarization of the previous layers is required to ensure a flat surface prior to subsequent lithography. Without it, the levels would become increasingly crooked, extending outside

8480-530: The name of its 10 nm process to position it as a 7 nm process. As transistors become smaller, new effects start to influence design decisions such as self-heating of the transistors, and other effects such as electromigration have become more evident since the 16nm node. In 2011, Intel demonstrated Fin field-effect transistors (FinFETs), where the gate surrounds the channel on three sides, allowing for increased energy efficiency and lower gate delay—and thus greater performance—over planar transistors at

8586-443: The node with the highest transistor density is TSMC's 5   nanometer N5 node, with a density of 171.3   million transistors per square millimeter. In 2019, Samsung and TSMC announced plans to produce 3 nanometer nodes. GlobalFoundries has decided to stop the development of new nodes beyond 12 nanometers in order to save resources, as it has determined that setting up a new fab to handle sub-12 nm orders would be beyond

8692-474: The number of defects caused by dust particles. Also, fabs have as few people as possible in the cleanroom to make maintaining the cleanroom environment easier, since people, even when wearing cleanroom suits, shed large amounts of particles, especially when walking. A typical wafer is made out of extremely pure silicon that is grown into mono-crystalline cylindrical ingots ( boules ) up to 300 mm (slightly less than 12 inches) in diameter using

8798-403: The person was pressing on the glass), the system was somewhat pressure-sensitive as well. Of note, this system was input only and not able to display graphics. In 1983, Bell Labs at Murray Hill published a comprehensive discussion of touch-screen based interfaces, though it makes no mention of multiple fingers. In the same year, the video-based Video Place/Video Desk system of Myron Krueger

8904-415: The quick developments in this field, and many companies using the term to market older technology which is called gesture-enhanced single-touch or several other terms by other companies and researchers. Several other similar or related terms attempt to differentiate between whether a device can exactly determine or only approximate the location of different points of contact to further differentiate between

9010-469: The same time but without the capability to create vertical walls. Plasma ALE was initially adopted for etching contacts in transistors, and since the 7nm node it is also used to create transistor structures by etching them. Front-end surface engineering is followed by growth of the gate dielectric (traditionally silicon dioxide ), patterning of the gate, patterning of the source and drain regions, and subsequent implantation or diffusion of dopants to obtain

9116-405: The screen to activate a switch (or a U-shaped gesture for a toggle switch), and touchscreen keyboards (including a study that showed that users could type at 25 words per minute for a touchscreen keyboard compared with 58 words per minute for a standard keyboard, with multi-touch hypothesized to improve data entry rate); multi-touch gestures such as selecting a range of a line, connecting objects, and

9222-469: The software side of multi-touch input systems. A 1982 system at the University of Toronto used a frosted-glass panel with a camera placed behind the glass. When a finger or several fingers pressed on the glass, the camera would detect the action as one or more black spots on an otherwise white background, allowing it to be registered as an input. Since the size of a dot was dependent on pressure (how hard

9328-455: The standard until the introduction of 300 mm diameter wafers in 2000. Bridge tools were used in the transition from 150 mm wafers to 200 mm wafers and in the transition from 200 mm to 300 mm wafers. The semiconductor industry has adopted larger wafers to cope with the increased demand for chips as larger wafers provide more surface area per wafer. Over time, the industry shifted to 300 mm wafers which brought along

9434-440: The term resulted from the quick developments in this field, and many companies using the term to market older technology which is called gesture-enhanced single-touch or several other terms by other companies and researchers. Several other similar or related terms attempt to differentiate between whether a device can exactly determine or only approximate the location of different points of contact to further differentiate between

9540-505: The time 150 mm wafers arrived, the cassettes were not dipped and were only used as wafer carriers and holders to store wafers, and robotics became prevalent for handling wafers. With 200 mm wafers manual handling of wafer cassettes becomes risky as they are heavier. In the 1970s, several companies migrated their semiconductor manufacturing technology from bipolar to CMOS technology. Semiconductor manufacturing equipment has been considered costly since 1978. In 1984, KLA developed

9646-611: The transition from 200 mm to 300 mm wafers in 2001, many bridge tools were used which could process both 200 mm and 300 mm wafers. At the time, 18 companies could manufacture chips in the leading edge 130nm process. In 2006, 450 mm wafers were expected to be adopted in 2012, and 675 mm wafers were expected to be used by 2021. Since 2009, "node" has become a commercial name for marketing purposes that indicates new generations of process technologies, without any relation to gate length, metal pitch or gate pitch. For example, GlobalFoundries ' 7 nm process

9752-504: The two types of transistors separately and then stacked them. This is a list of processing techniques that are employed numerous times throughout the construction of a modern electronic device; this list does not necessarily imply a specific order, nor that all techniques are taken during manufacture as, in practice the order and which techniques are applied, are often specific to process offerings by foundries, or specific to an integrated device manufacturer (IDM) for their own products, and

9858-484: The user's touch and their electronic devices and became commercial on May 29, 2007. Similarly, in 2001, Mitsubishi Electric Research Laboratories (MERL) began development of a multi-touch, multi-user system called DiamondTouch . In 2008, the Diamondtouch became a commercial product and is also based on capacitance, but able to differentiate between multiple simultaneous users or rather, the chairs in which each user

9964-478: The various processing steps. For example, thin film metrology based on ellipsometry or reflectometry is used to tightly control the thickness of gate oxide, as well as the thickness, refractive index, and extinction coefficient of photoresist and other coatings. Wafer metrology equipment/tools, or wafer inspection tools are used to verify that the wafers haven't been damaged by previous processing steps up until testing; if too many dies on one wafer have failed,

10070-415: The various technological capabilities, but they are often used as synonyms in marketing. The use of touchscreen technology predates both multi-touch technology and the personal computer. Early synthesizer and electronic instrument builders like Hugh Le Caine and Robert Moog experimented with using touch-sensitive capacitance sensors to control the sounds made by their instruments. IBM began building

10176-495: The various technological capabilities, but they are often used as synonyms in marketing. Multi-touch is commonly implemented using capacitive sensing technology in mobile devices and smart devices . A capacitive touchscreen typically consists of a capacitive touch sensor , application-specific integrated circuit (ASIC) controller and digital signal processor (DSP) fabricated from CMOS (complementary metal–oxide–semiconductor ) technology. A more recent alternative approach

10282-445: The wafers are transported inside special sealed plastic boxes called FOUPs . FOUPs in many fabs contain an internal nitrogen atmosphere which helps prevent copper from oxidizing on the wafers. Copper is used in modern semiconductors for wiring. The insides of the processing equipment and FOUPs is kept cleaner than the surrounding air in the cleanroom. This internal atmosphere is known as a mini-environment and helps improve yield which

10388-422: The world economy and the national security of some countries. The US has asked TSMC to not produce semiconductors for Huawei, a Chinese company. CFET transistors were explored, which stacks NMOS and PMOS transistors on top of each other. Two approaches were evaluated for constructing these transistors: a monolithic approach which built both types of transistors in one process, and a sequential approach which built

10494-738: The world. Samsung Electronics , the world's largest manufacturer of semiconductors, has facilities in South Korea and the US. Intel , the second-largest manufacturer, has facilities in Europe and Asia as well as the US. TSMC , the world's largest pure play foundry , has facilities in Taiwan, China, Singapore, and the US. Qualcomm and Broadcom are among the biggest fabless semiconductor companies, outsourcing their production to companies like TSMC. They also have facilities spread in different countries. As

10600-429: Was also used in interconnects in early chips. More recently, as the number of interconnect levels for logic has substantially increased due to the large number of transistors that are now interconnected in a modern microprocessor , the timing delay in the wiring has become so significant as to prompt a change in wiring material (from aluminum to copper interconnect layer) alongside a change in dielectric material in

10706-408: Was influential in development of multi-touch gestures such as pinch-to-zoom, though this system had no touch interaction itself. By 1984, both Bell Labs and Carnegie Mellon University had working multi-touch-screen prototypes – both input and graphics – that could respond interactively in response to multiple finger inputs. The Bell Labs system was based on capacitive coupling of fingers, whereas

10812-513: Was not as big of an issue as it is today in device manufacturing. In the 1960s, workers could work on semiconductor devices in street clothing. As devices become more integrated, cleanrooms must become even cleaner. Today, fabrication plants are pressurized with filtered air to remove even the smallest particles, which could come to rest on the wafers and contribute to defects. The ceilings of semiconductor cleanrooms have fan filter units (FFUs) at regular intervals to constantly replace and filter

10918-409: Was released on July 27, 2010. It is made of glass and aluminum in the same style as Apple's Wireless Keyboard and sits flush with it. The entire trackpad can be used as a button, pressing down on the trackpad puts pressure on two circular feet below to register a click. The trackpad connects via Bluetooth and is powered by two AA batteries. The second generation Magic Trackpad, initially marketed as

11024-466: Was seen as a potential low cost alternative to FinFETs. As of 2019, 14 nanometer and 10 nanometer chips are in mass production by Intel, UMC , TSMC, Samsung, Micron , SK Hynix , Toshiba Memory and GlobalFoundries, with 7 nanometer process chips in mass production by TSMC and Samsung, although their 7 nanometer node definition is similar to Intel's 10 nanometer process. The 5 nanometer process began being produced by Samsung in 2018. As of 2019,

11130-475: Was similar to Intel's 10 nm process , thus the conventional notion of a process node has become blurred. Additionally, TSMC and Samsung's 10 nm processes are only slightly denser than Intel's 14 nm in transistor density. They are actually much closer to Intel's 14 nm process than they are to Intel's 10 nm process (e.g. Samsung's 10 nm processes' fin pitch is the exact same as that of Intel's 14 nm process: 42 nm). Intel has changed

11236-413: Was the first to adopt copper interconnects. In 2014, Applied Materials proposed the use of cobalt in interconnects at the 22nm node, used for encapsulating copper interconnects in cobalt to prevent electromigration, replacing tantalum nitride since it needs to be thicker than cobalt in this application. The highly serialized nature of wafer processing has increased the demand for metrology in between

#586413