Misplaced Pages

#84915

62-535: The platform was created after December 12, 2002, as STMicroelectronics and Texas Instruments jointly announced an initiative for Open Mobile Application Processor Interfaces (OMAPI) intended to be used with 2.5 and 3G mobile phones , that were going to be produced during 2003. (This was later merged into a larger initiative and renamed the MIPI Alliance .) The OMAP was Texas Instruments' implementation of this standard. (The STMicroelectronics implementation

124-521: A PowerVR SGX540 graphics processing unit (GPU) . The 4430's GPU runs at a clock frequency of 304 Mhz, and the 4460's GPU runs at 384 MHz. The 4470 has a PowerVR SGX544 GPU that supports DirectX 9 that enables it for use in Windows 8 . It also has a dedicated 2D graphics core for increased power efficiency up to 50-90%. The 5th generation OMAP, OMAP 5 SoC uses a dual-core ARM Cortex-A15 CPU with two additional Cortex-M4 cores to offload

186-498: A SATA 2.0 controller. These are marketed only to handset manufacturers. They are intended to be highly integrated, low cost chips for consumer products. The OMAP-DM series are intended to be used as digital media coprocessors for mobile devices with high megapixel digital still and video cameras. These OMAP-DM chips incorporate both an ARM processor and an Image Signal Processor (ISP) to accelerate processing of camera images. These are marketed only to handset manufacturers. Many of

248-619: A TI-enhanced ARM925 core (ARM925T), and then changed to a standard ARM926 core. It included many variants, most easily distinguished according to manufacturing technology ( 130 nm except for the OMAP171x series), CPU, peripheral set, and distribution channel (direct to large handset vendors, or through catalog-based distributors). In March 2009, the OMAP1710 family chips are still available to handset vendors. Products using OMAP 1 processors include hundreds of cell phone models, and

310-453: A common R&D center for submicrometre technologies as part of the 1990 Grenoble 92 partnership between SGS-Thomson and CNET , the R&;D center of French telecom company France Telecom . The 200 mm (8 in) fab, known as Crolles 1, is the company's first and was built as part of a 1991 partnership between SGS-Thomson and Philips to develop new manufacturing technologies. Crolles 1

372-769: A core contains an FPU, it is known as a Cortex-M7F, otherwise it is a Cortex-M7. Key features of the Cortex-M7 core are: Silicon options: The following microcontrollers are based on the Cortex-M7 core: The Cortex-M23 core was announced in October 2016 and based on the ARMv8-M architecture that was previously announced in November 2015. Conceptually the Cortex-M23 is similar to a Cortex-M0+ plus integer divide instructions and TrustZone security features, and also has

434-400: A former Thomson plant in the center of Aix-en-Provence operating since the 1960s was closed and staff were transferred to the new Rousset site. The original 100 mm (4 in) fab was upgraded into 130 mm (5 in) and later 150 mm (6 in) fab in 1996. It is now being shut down. The site also has a "Wafer Level Chip Scale Packaging" accreditation for eSIM ICs. In 1988,

496-738: A particular ARM CPU chip, consult the manufacturer datasheet and related documentation. Some of the silicon options for the Cortex-M cores are: Additional silicon options: The Cortex-M0 / M0+ / M1 implement the ARMv6-M architecture, the Cortex-M3 implements the ARMv7-M architecture, the Cortex-M4 / Cortex-M7 implements the ARMv7E-M architecture, the Cortex-M23 / M33 / M35P implement

558-461: A popular replacements for 8-bit chips in applications that benefit from 32-bit math operations, and replacing older legacy ARM cores such as ARM7 and ARM9 . ARM Limited neither manufactures nor sells CPU devices based on its own designs, but rather licenses the processor architecture to interested parties. Arm offers a variety of licensing terms, varying in cost and deliverables. To all licensees, Arm provides an integratable hardware description of

620-581: A radiofrequency products facility, the Bouskoura site now hosts back-end manufacturing activity, which includes chip testing and packaging. Since 2022 it also features a production line for silicon carbide products that primarily will be used in electric vehicles. The Norrköping plant is a wafer fab that, at the start of production in 2021, was the first to produce 200mm (8 in) Silicone Carbide wafers. The wafers are mostly used for SiC power devices. The Phoenix , Arizona 8 inch (200 mm) fab,

682-409: A secondary core: The Cortex-M7 is a high-performance core with almost double the power efficiency of the older Cortex-M4. It features a 6-stage superscalar pipeline with branch prediction and an optional floating-point unit capable of single-precision and optionally double-precision operations. The instruction and data buses have been enlarged to 64-bit wide over the previous 32-bit buses. If

SECTION 10

#1732802600085

744-425: A significant performance advantage over Nvidia Tegra 2's ARM Cortex-A9s with non-vector floating point units. It also uses a dual-channel LPDDR2 memory controller compared to Nvidia Tegra 2's single-channel memory controller. All OMAP 4 processors come with an IVA3 multimedia hardware accelerator with a programmable DSP that enables 1080p Full HD and multi-standard video encoding and decoding. The 4430 and 4460 use

806-506: A simple instruction trace buffer. The Cortex-M0+ also received Cortex-M3 and Cortex-M4 features, which can be added as silicon options, such as the memory protection unit (MPU) and the vector table relocation. Key features of the Cortex-M0+ core are: Silicon options: The following microcontrollers are based on the Cortex-M0+ core: The following chips have a Cortex-M0+ as a secondary core: The smallest ARM microcontrollers are of

868-525: A small group of employees from the Thomson Rousset plant (including the director, Marc Lassus) founded a start-up company, Gemalto (formerly known as Gemplus ), which became a leader in the smartcard industry. Employing 1,500 staff, this site hosts a fab and R&D centers. Employing 6,000 staff, the Milan facilities match Grenoble in importance. Agrate Brianza employs around 4,000 staff and

930-525: Is a 45 nm version of the 65 nm OMAP34x with higher clock speed. The OMAP 3611 found in devices like the Bookeen's Cybook Odyssey is a licensed crippled version of the OMAP 3621, both are the same silicon (as marking are the same) but officially the 3611 was sold to be only able to drive e-Ink screen and does not have access to IVA & DSP. The video technology in the higher end OMAP 3 parts

992-623: Is a European multinational semiconductor contract manufacturing and design company. It is the largest of such companies in Europe . It was founded in 1987 from the merger of two state-owned semiconductor corporations: Thomson Semiconducteurs of France and SGS Microelettronica of Italy . The company is incorporated in the Netherlands and headquartered in Plan-les-Ouates , Switzerland . Its shares are traded on Euronext Paris ,

1054-605: Is a historical base of the company (ex SGS). The site has several fab lines (including a 300 mm (12 in) fab) and an R&D center. Castelletto , employs 300 to 400 staff and hosts some divisions and R&D centers. Update-2012: Numonyx JV (with Intel) is acquired by Micron. As such, R2 Fab (Agrate previous R&D 200-mm Fab) is currently a Micron entity The Catania plant in Sicily employs 5,000 staff and hosts several R&D centers and divisions, focusing on flash memory technologies as well as two fabs . The plant

1116-576: Is derived in part from the DaVinci product line, which first packaged higher end C64x+ DSPs and image processing controllers with ARM9 processors last seen in the older OMAP 1 generation or ARM Cortex-A8. Not highlighted in the list below is that each OMAP 3 SoC has an "Image, Video, Audio" (IVA2) accelerator. These units do not all have the same capabilities. Most devices support 12 megapixel camera images, though some support 5 or 3 megapixels. Some support HD imaging. The OMAP 4 line consists of

1178-418: Is one of the historical bases of the company (ex SGS). All the historical wafer fab lines are now closed but the site hosts the headquarters of many divisions (marketing, design, industrialization) and an important R&D center, focused on silicon and software design and fab process development. The Crolles site hosts a 200 mm (8 in) and a 300 mm (12 in) fab and was originally built as

1240-471: Is that Cortex-M cores have no memory management unit (MMU) for virtual memory , considered essential for "full-fledged" operating systems . Cortex-M programs instead run bare metal or on one of the many real-time operating systems which support a Cortex-M . Though 8-bit microcontrollers were very popular in the past, Cortex-M has slowly been chipping away at the 8-bit market as the prices of low-end Cortex-M chips have moved downward. Cortex-M have become

1302-688: Is use of a floating point DSP, instead of the more customary fixed point one. The Hawkboard uses the OMAP-L138 Many mobile phones released during early 21st century have used OMAP SoCs, including the Nokia 3230, N9, N90, N91, N92, N95, N82, E61, E62, E63 and E90 mobile phones, as well as the Nokia 770, N800, N810 and N900 Internet tablets , Motorola Droid , Droid X , and Droid 2 , and some early Samsung Galaxy devices, like Samsung Galaxy Tab 2 7.0 and Galaxy S II variant GT-I9100G. The OMAP3430

SECTION 20

#1732802600085

1364-543: Is used in the Palm Pre , Pandora , and Touch Book . Other devices that use OMAP processors include Sony Ericsson's Satio (Idou) and Vivaz , most Samsung phones running Symbian (including Omnia HD ), the Nook Color , some Archos tablets (such as Archos 80 gen 9 and Archos 101 gen 9), Kindle Fire HD , Blackberry Playbook , Kobo Arc , and B&N Nook HD . Some all-in-one smart displays use OMAP 4 SoCs, including

1426-596: The ARMv8-M architecture, and the Cortex-M52 / M55 / M85 implements the ARMv8.1-M architecture. The architectures are binary instruction upward compatible from ARMv6-M to ARMv7-M to ARMv7E-M. Binary instructions available for the Cortex-M0 / Cortex-M0+ / Cortex-M1 can execute without modification on the Cortex-M3 / Cortex-M4 / Cortex-M7. Binary instructions available for the Cortex-M3 can execute without modification on

1488-586: The Borsa Italiana and the New York Stock Exchange . ST was formed in 1987 by the merger of two government-owned semiconductor companies: Italian SGS Microelettronica (where SGS stands for Società Generale Semiconduttori , "General Semiconductor Company"), and French Thomson Semiconducteurs , the semiconductor arm of Thomson . SGS Microelettronica originated in 1972 from a previous merger of two companies: Thomson Semiconducteurs

1550-521: The Carrollton , Texas 6 inch (150 mm) fab, and the Ain Sebaa , Morocco fab are beginning rampdown plans, and are destined to close by 2010. The Casablanca , Morocco site consists of two assembly parts (Bouskoura and Aïn Sebaâ) and totals around 4000 employees. It was opened in the 1960s by Thomson. The Bristol , United Kingdom site employing well over 300 at its peak (in 2001/2) but

1612-690: The Nokia 770 Internet tablets . These parts were only marketed to handset vendors. Products using these include both Internet tablets and mobile phones : The 3rd generation OMAP, the OMAP ;3 is broken into 3 distinct groups: the OMAP34x, the OMAP35x, and the OMAP36x. OMAP34x and OMAP36x are distributed directly to large handset (such as cell phone) manufacturers. OMAP35x is a variant of OMAP34x intended for catalog distribution channels. The OMAP36x

1674-563: The 32-bit ARM instruction set is duplicated in many ways by the Thumb-1 and Thumb-2 instruction sets, but some ARM features don't have a similar feature: The 16-bit Thumb-1 instruction set has evolved over time since it was first released in the legacy ARM7T cores with the ARMv4T architecture. New Thumb-1 instructions were added as each legacy ARMv5 / ARMv6 / ARMv6T2 architectures were released. Some 16-bit Thumb-1 instructions were removed from

1736-581: The A15s in less computationally intensive tasks to increase power efficiency, two PowerVR SGX544MP graphics cores and a dedicated TI 2D BitBlt graphics accelerator, a multi-pipe display sub-system and a signal processor. They respectively support 24 and 20 megapixel cameras for front and rear 3D HD video recording. The chip also supports up to 8 GB of dual channel LPDDR2/ DDR3 memory, output to four HD 3D displays and 3D HDMI 1.4 video output. OMAP 5 also includes three USB 2.0 ports, one lowspeed USB 3.0 OTG port and

1798-842: The ARM core, as well as complete software development toolset and the right to sell manufactured silicon containing the ARM CPU. Integrated Device Manufacturers (IDM) receive the ARM Processor IP as synthesizable RTL (written in Verilog ). In this form, they have the ability to perform architectural level optimizations and extensions. This allows the manufacturer to achieve custom design goals, such as higher clock speed, very low power consumption, instruction set extensions (including floating point), optimizations for size, debug support, etc. To determine which components have been included in

1860-429: The Cortex-M cores: The Cortex-M0 core is optimized for small silicon die size and use in the lowest price chips. Key features of the Cortex-M0 core are: Silicon options: The following microcontrollers are based on the Cortex-M0 core: The following chips have a Cortex-M0 as a secondary core: The Cortex-M0+ is an optimized superset of the Cortex-M0. The Cortex-M0+ has complete instruction set compatibility with

1922-471: The Cortex-M0 thus allowing the use of the same compiler and debug tools. The Cortex-M0+ pipeline was reduced from 3 to 2 stages, which lowers the power usage and increases performance (higher average IPC due to branches taking one fewer cycle). In addition to debug features in the existing Cortex-M0, a silicon option can be added to the Cortex-M0+ called the Micro Trace Buffer (MTB) which provides

OMAP - Misplaced Pages Continue

1984-514: The Cortex-M0+ type (as of 2014, smallest at 1.6 mm by 2 mm in a chip-scale package is Kinetis KL03). On 21 June 2018, the " world's smallest computer' ", or computer device was announced – based on the ARM Cortex-M0+ (and including RAM and wireless transmitters and receivers based on photovoltaics ) – by University of Michigan researchers at the 2018 Symposia on VLSI Technology and Circuits with

2046-519: The Cortex-M1 core are: Silicon options: The following vendors support the Cortex-M1 as soft-cores on their FPGA chips: Key features of the Cortex-M3 core are: Silicon options: The following microcontrollers are based on the Cortex-M3 core: The following chips have a Cortex-M3 as a secondary core: The following FPGAs include a Cortex-M3 core: The following vendors support the Cortex-M3 as soft-cores on their FPGA chips: Conceptually

2108-415: The Cortex-M4 / Cortex-M7 / Cortex-M33 / Cortex-M35P. Only Thumb-1 and Thumb-2 instruction sets are supported in Cortex-M architectures; the legacy 32-bit ARM instruction set isn't supported. All Cortex-M cores implement a common subset of instructions that consists of most Thumb-1, some Thumb-2, including a 32-bit result multiply. The Cortex-M0 / Cortex-M0+ / Cortex-M1 / Cortex-M23 were designed to create

2170-461: The Cortex-M4 is a Cortex-M3 plus DSP instructions, and optional floating-point unit (FPU). A core with an FPU is known as Cortex-M4F. Key features of the Cortex-M4 core are: Silicon options: The following microcontrollers are based on the Cortex-M4 core: The following microcontrollers are based on the Cortex-M4F (M4 + FPU ) core: The following chips have either a Cortex-M4 or M4F as

2232-700: The EU supported STMicroelectronics for the construction of a silicon carbide wafer plant in Catania with €293 million through the Recovery and Resilience Facility to be completed in 2026, and in line with the European Chips Act . STmicro eSIM and SIM production facility for embedded form factor eSIM. As of 2010, ST employed around 1,800 people in Kirkop , making it the largest private sector employer , and

2294-510: The OMAP 4430, OMAP 4460 (formerly named 4440), and OMAP 4470. The 4th generation OMAPs have a dual-core ARM Cortex-A9 CPU with two ARM Cortex-M3 cores, as part of the "Ducati" sub-system for off-loading low-level tasks. The OMAP 4430 was the SoC used in Google Glass . OMAP 4 uses ARM Cortex-A9's with ARM's SIMD engine (Media Processing Engine, aka NEON) which in some cases may have

2356-458: The OMAP product line is from partnership with cell phone vendors, and the main distribution channel involves sales directly to such wireless handset vendors. Parts developed to suit evolving cell phone requirements are flexible and powerful enough to support sales through less specialized catalog channels; some OMAP 1 parts, and many OMAP 3 parts, have catalog versions with different sales and support models. Parts that are obsolete from

2418-613: The Viewsonic VSD220, which uses an OMAP 4430. OMAP SoCs are also used as the basis for a number of hobbyist, prototyping and evaluation boards, such as the BeagleBoard , PandaBoard , OMAP3 Board, Gumstix and Presonus digital mixing boards Motorola MOTOTRBO 2. generation radios use the OMAP-L132 or OMAP-L138 secure CPU. STMicroelectronics STMicroelectronics NV (commonly referred to as ST or STMicro )

2480-572: The company also listed on the Italian Bourse in Milan . In 2002, Motorola and TSMC joined ST and Philips in a new technology partnership. The Crolles 2 Alliance was created with a new 12" wafer manufacturing facility located in Crolles , France. In 2005, chief executive officer Pasquale Pistorio was succeeded by Carlo Bozotti, who then headed the memory products division and had been with

2542-538: The company’s predecessor since 1977. By 2005, ST was ranked fifth, behind Intel , Samsung , Texas Instruments and Toshiba , but ahead of Infineon , Renesas , NEC , NXP Semiconductors , and Freescale . The company was the largest European semiconductors supplier, ahead of Infineon and NXP. Early in 2007, NXP Semiconductors (formerly Philips Semiconductors) and Freescale (formerly Motorola Semiconductors) decided to stop their participation in Crolles 2 Alliance. Under

OMAP - Misplaced Pages Continue

2604-544: The country's leading exporter . In 1970, SGS created its first assembly back-end plant in Singapore, in the area of Toa Payoh . Then in 1981, SGS decided to build a wafer fab in Singapore. The Singapore technical engineers have been trained in Italy and the fab of Ang Mo Kio started to produce its first wafers in 1984. Converted up to 200 mm (8 in) fab, this is now an important 200 mm (8 in) wafer fab of

2666-616: The facility and to work together on process development. The technologies developed at the facility were also used by global semiconductor foundry TSMC of Taiwan, allowing TSMC to build the products developed in Crolles on behalf of the Alliance partners who required such foundry capacity. A new fab is under construction since 2015. Employing around 3,000 staff, Rousset hosts several division headquarters including smartcards , microcontrollers , and EEPROM as well as several R&D centers. Rousset also hosts an 8-inch (200-mm) fab, which

2728-424: The group. Ang Mo Kio also hosts some design centers. As of 2004, the site employed 6,000 staff. Update-2012: Numonyx JV (with Intel) is acquired by Micron in 2010. As such, AMK8 Fab (200mm HVM Fab) is currently a Micron entity. AMK5 and AMK6 remains to be STM entities. Update-2019: AMK8 has been reacquired by STM from Micron. Application, design and support. about 110 employees. Divisions: MCD Founded in 1979 as

2790-421: The main component of microcontroller chips, sometimes they are embedded inside other types of chips too. The Cortex-M family consists of Cortex-M0, Cortex-M0+, Cortex-M1, Cortex-M3, Cortex-M4, Cortex-M7, Cortex-M23, Cortex-M33, Cortex-M35P, Cortex-M52, Cortex-M55, Cortex-M85. A floating-point unit (FPU) option is available for Cortex-M4 / M7 / M33 / M35P / M52 / M55 / M85 cores, and when included in

2852-580: The new company and NXP 20%. This joint venture began on August 20, 2008. On February 10, 2009, ST Ericsson , a joint venture bringing together ST-NXP Wireless and Ericsson Mobile Platforms, was established. ST Ericsson was a multinational manufacturer of wireless products and semiconductors , supplying to mobile device manufacturers. ST-Ericsson was a 50/50 joint venture of STMicroelectronics and Ericsson established on February 3, 2009, and dissolved on August 2, 2013. Headquartered in Geneva , Switzerland, it

2914-435: The newer versions are highly integrated for use in very low cost cell phones. The OMAP L-1x parts are marketed only through catalog channels, and have a different technological heritage than the other OMAP parts. Rather than deriving directly from cell phone product lines, they grew from the video-oriented DaVinci product line by removing the video-specific features while using upgraded DaVinci peripherals. A notable feature

2976-486: The paper "A 0.04mm 16nW Wireless and Batteryless Sensor System with Integrated Cortex-M0+ Processor and Optical Communication for Cellular Temperature Measurement." The device is one-tenth the size of IBM's previously claimed world-record-sized computer from months back in March 2018, which is smaller than a grain of salt. The Cortex-M1 is an optimized core especially designed to be loaded into FPGA chips. Key features of

3038-490: The perspective of handset vendors may still be needed to support products developed using catalog parts and distributor-based inventory management. These are parts originally intended for use as application processors in smartphones , with processors powerful enough to run significant operating systems (such as Linux , FreeBSD , Android or Symbian ), support connectivity to personal computers, and support various audio and video applications. The OMAP 1 family started with

3100-414: The production is scaled at 0.18 μm, 0.13 μm, 90 nm and 65 nm (measurements of transistor gate length). STMicroelectronics also owns back-end plants, where silicon dies are assembled and bonded into plastic or ceramic packages. Major sites include: Grenoble is one of the company's most important R&D centres, employing around 4,000 staff. The Polygone site employs 2,200 staff and

3162-537: The silicon these cores are sometimes known as "Cortex-MxF", where 'x' is the core variant. The ARM Cortex-M family are ARM microprocessor cores that are designed for use in microcontrollers , ASICs , ASSPs , FPGAs , and SoCs . Cortex-M cores are commonly used as dedicated microcontroller chips, but also are "hidden" inside of SoC chips as power management controllers, I/O controllers, system controllers, touch screen controllers, smart battery controllers, and sensor controllers. The main difference from Cortex-A cores

SECTION 50

#1732802600085

3224-976: The smallest silicon die, thus having the fewest instructions of the Cortex-M family. The Cortex-M0 / M0+ / M1 include Thumb-1 instructions, except new instructions (CBZ, CBNZ, IT) which were added in ARMv7-M architecture. The Cortex-M0 / M0+ / M1 include a minor subset of Thumb-2 instructions (BL, DMB, DSB, ISB, MRS, MSR). The Cortex-M3 / M4 / M7 / M33 / M35P have all base Thumb-1 and Thumb-2 instructions. The Cortex-M3 adds three Thumb-1 instructions, all Thumb-2 instructions, hardware integer divide, and saturation arithmetic instructions. The Cortex-M4 adds DSP instructions and an optional single-precision floating-point unit (VFPv4-SP). The Cortex-M7 adds an optional double-precision FPU (VFPv5). The Cortex-M23 / M33 / M35P / M52 / M55 / M85 add TrustZone instructions. The ARM architecture for ARM Cortex-M series removed some features from older legacy cores: The capabilities of

3286-414: The terms of the agreement the Alliance came to an end on December 31, 2007. On May 22, 2007, ST and Intel created a joint venture in the memory application called Numonyx : this new company merged ST and Intel Flash Memory activities. Semiconductor market consolidation continued with ST and NXP announcing on April 10, 2008, the creation of a new joint venture of their mobile activities, with ST owning 80% of

3348-487: Was a fabless company , outsourcing semiconductor manufacturing to foundry companies. In 2011, ST announced the creation of a joint lab with Sant'Anna School of Advanced Studies . The lab focuses on research and innovation in biorobotics , smart systems and microelectronics. Past collaborations with Sant'Anna School of Advanced Studies included DustBot, a platform that integrated self-navigating "service robots" for waste collection. In 2018, chief executive Carlo Bozotti

3410-570: Was created in 1982 by the French government's widespread nationalization of industries following the election of socialist François Mitterrand to the presidency . It included: At the time of the merger of these two companies in 1987, the new corporation was named SGS-THOMSON and was led by chief executive officer Pasquale Pistorio. The company took its current name of STMicroelectronics in May 1998 following Thomson's sale of its shares. After its creation ST

3472-604: Was launched in 1961 by ATES to supply under licensing to RCA of the US and initially using germanium . The site's two major wafer fabs are a 200 mm (8 in) fab, opened in April 1997 by then-Italian Prime Minister Romano Prodi , and a 300 mm (12 in) fab that has never been completed and which was transferred in its current state to "Numonyx" in 2008. A new manufacturing facility for silicon carbide ( SiC ) substrates of 150 mm should open here in 2023. In October 2022,

3534-761: Was named Nomadik .) OMAP enjoyed some success in the smartphone and tablet market until 2011 when it lost ground to Qualcomm Snapdragon . On September 26, 2012, Texas Instruments announced that they would wind down their operations in smartphone and tablet oriented chips and focus on embedded platforms instead. On November 14, 2012, Texas Instruments announced they would cut 1,700 jobs due to their shift from mobile to embedded platforms. The last OMAP5 chips were released in Q2 2013. The OMAP family consists of three product groups classified by performance and intended application: Further, two main distribution channels exist, and not all parts are available in both channels. The genesis of

3596-403: Was opened on May 15, 2000 by French prime minister Lionel Jospin . The site opened in 1979 as a 100 mm (3.9 in) fab operated by Eurotechnique, a joint venture between Saint-Gobain of France and National Semiconductor of the US. Rousset was sold to Thomson-CSF in 1982 as part of the French government's 1981–82 nationalization of several industries. As part of the nationalisation,

3658-676: Was opened on September 9, 1993 by Gérard Longuet, French minister for industry, and Alain Carignon, mayor of Grenoble. The 300 mm (12 in) fab was inaugurated by French president Jacques Chirac , on February 27, 2003. It includes an R&D center which focuses on developing new nanometric technology processes for 90-nm to 32-nm scale using 300 mm (12 in) wafers and it was developed for The Crolles 2 Alliance . This alliance of STMicroelectronics, TSMC , NXP Semiconductors (formerly Philips semiconductor) and Freescale (formerly Motorola semiconductor) partnered in 2002 to develop

3720-465: Was ramped down to approx. 150 employees at close by early 2014. The Ottawa, Ontario , Canada plant (approx. 450 employees) will close down by 2013 end. ARM Cortex-M#Cortex-M3 The ARM Cortex-M is a group of 32-bit RISC ARM processor cores licensed by ARM Limited . These cores are optimized for low-cost and energy-efficient integrated circuits, which have been embedded in tens of billions of consumer devices. Though they are most often

3782-454: Was ranked 14th among the top 20 semiconductor suppliers with sales of around US$ 850 million. The company has participated in the consolidation of the semiconductor industry since its formation, with acquisitions including: On December 8, 1994, the company completed its initial public offering on the Paris and New York stock exchanges. Owner Thomson SA sold its stake in the company in 1998 when

SECTION 60

#1732802600085

3844-624: Was succeeded by Jean-Marc Chery. In 2023, STMicroelectronics partnered with Synopsys to design a working chip on Microsoft Corp’s cloud, marking the first time AI software had been utilized for chip design. In 2024, ST became the sixth shareholder of Quintauris , a joint company with the goal of standardizing RISC-V ecosystem. As of December 31, 2014, the shareholders were: Unlike fabless semiconductor companies , STMicroelectronics owns and operates its own semiconductor wafer fabs . The company owned five 5-inch (200 mm) wafer fabs and 1 12-inch (300 mm) wafer fab in 2006. Most of

#84915