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A contactless smart card is a contactless credential whose dimensions are credit card size. Its embedded integrated circuits can store (and sometimes process) data and communicate with a terminal via NFC . Commonplace uses include transit tickets, bank cards and passports.

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78-574: The Chicago Card and the Chicago Card Plus were contactless smart cards used by riders of the Chicago Transit Authority (CTA) and Pace to electronically pay for bus and train fares in the city of Chicago , Illinois , USA and the surrounding suburbs. On June 1, 2014, CTA and Pace stopped accepting these cards as part of a transition to Ventra . The blue Chicago Card was a stored value card. Users added value to

156-492: A design flow that engineers use to design, verify, and analyze entire semiconductor chips. Some of the latest EDA tools use artificial intelligence (AI) to help engineers save time and improve chip performance. Integrated circuits can be broadly classified into analog , digital and mixed signal , consisting of analog and digital signaling on the same IC. Digital integrated circuits can contain billions of logic gates , flip-flops , multiplexers , and other circuits in

234-627: A fabrication facility (commonly known as a semiconductor fab ) can cost over US$ 12 billion to construct. The cost of a fabrication facility rises over time because of increased complexity of new products; this is known as Rock's law . Such a facility features: ICs can be manufactured either in-house by integrated device manufacturers (IDMs) or using the foundry model . IDMs are vertically integrated companies (like Intel and Samsung ) that design, manufacture and sell their own ICs, and may offer design and/or manufacturing (foundry) services to other companies (the latter often to fabless companies ). In

312-509: A microchip , computer chip , or simply chip , is a small electronic device made up of multiple interconnected electronic components such as transistors , resistors , and capacitors . These components are etched onto a small piece of semiconductor material, usually silicon . Integrated circuits are used in a wide range of electronic devices, including computers , smartphones , and televisions , to perform various functions such as processing and storing information. They have greatly impacted

390-412: A microprocessor will have memory on the chip. (See the regular array structure at the bottom of the first image. ) Although the structures are intricate – with widths which have been shrinking for decades – the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to "expose"

468-466: A common active area, but there was no electrical isolation to separate them from each other. The monolithic integrated circuit chip was enabled by the inventions of the planar process by Jean Hoerni and p–n junction isolation by Kurt Lehovec . Hoerni's invention was built on Carl Frosch and Lincoln Derick's work on surface protection and passivation by silicon dioxide masking and predeposition, as well as Fuller, Ditzenberger's and others work on

546-561: A common substrate in a three-stage amplifier arrangement. Jacobi disclosed small and cheap hearing aids as typical industrial applications of his patent. An immediate commercial use of his patent has not been reported. Another early proponent of the concept was Geoffrey Dummer (1909–2002), a radar scientist working for the Royal Radar Establishment of the British Ministry of Defence . Dummer presented

624-525: A contract with Cubic to install smart card readers universally in 2000. In August 2000, a more extensive "Chicago Card" pilot program distributed stored-value smart cards to volunteer participants. The pilot program was expanded system-wide in November 2002. The Chicago Card Plus debuted in January 2004. "Go Lane" card readers were installed in the buses, starting in 2005, allowing Chicago Card users to bypass

702-491: A few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors , DSPs , and microcontrollers , use boolean algebra to process "one" and "zero" signals . Among the most advanced integrated circuits are the microprocessors or " cores ", used in personal computers, cell-phones, etc. Several cores may be integrated together in

780-408: A layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet ) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. Each device is tested before packaging using automated test equipment (ATE), in

858-423: A normal EMV card via their contact interface. The contactless interface provides similar data to a contact EMV transaction, but usually a subset of the capabilities (e.g. usually issuers will not allow balances to be increased via the contactless interface, instead requiring the card to be inserted into a device which uses the contact interface). EMV cards may carry an "offline balance" stored in their chip, similar to

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936-428: A number of steps for the p–n junction isolation of transistors on a chip, MOSFETs required no such steps but could be easily isolated from each other. Its advantage for integrated circuits was pointed out by Dawon Kahng in 1961. The list of IEEE milestones includes the first integrated circuit by Kilby in 1958, Hoerni's planar process and Noyce's planar IC in 1959. The earliest experimental MOS IC to be fabricated

1014-427: A pay-per-use basis. The account reloaded from the linked source either when the monthly pass expired or when a user-defined threshold was passed on a pay-per-use card. Because of this direct link to personal accounts, all Chicago Card Plus cards were registered by their users. CTA's Automated Fare Collection (AFC) system was installed in 1997 by Cubic Transportation Systems, Inc. , the largest provider of AFC systems in

1092-420: A process known as wafer testing , or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die . Each good die (plural dice , dies , or die ) is then connected into a package using aluminium (or gold) bond wires which are thermosonically bonded to pads , usually found around the edge of the die. Thermosonic bonding was first introduced by A. Coucoulas which provided

1170-421: A rate predicted by Moore's law , leading to large-scale integration (LSI) with hundreds of transistors on a single MOS chip by the late 1960s. Following the development of the self-aligned gate (silicon-gate) MOSFET by Robert Kerwin, Donald Klein and John Sarace at Bell Labs in 1967, the first silicon-gate MOS IC technology with self-aligned gates , the basis of all modern CMOS integrated circuits,

1248-694: A re-writeable smart card microchip that can be transcribed via radio waves. A contactless smart card is characterized as follows: Contactless smart cards can be used for identification, authentication, and data storage. They also provide a means of effecting business transactions in a flexible, secure, standard way with minimal human intervention. Contactless smart cards were first used for electronic ticketing in 1995 in Seoul, South Korea. Since then, smart cards with contactless interfaces have been increasingly popular for payment and ticketing applications such as mass transit. Globally, contactless fare collection

1326-407: A reliable means of forming these vital electrical connections to the outside world. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Industrial CT scanning can also be used. Test cost can account for over 25% of the cost of fabrication on lower-cost products, but can be negligible on low-yielding, larger, or higher-cost devices. As of 2022 ,

1404-426: A semiconductor to modulate its electronic properties. Doping is the process of adding dopants to a semiconductor material. Since a CMOS device only draws current on the transition between logic states , CMOS devices consume much less current than bipolar junction transistor devices. A random-access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even

1482-859: A single IC or chip. Digital memory chips and application-specific integrated circuits (ASICs) are examples of other families of integrated circuits. In the 1980s, programmable logic devices were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a chip to be programmed to do various LSI-type functions such as logic gates , adders and registers . Programmability comes in various forms – devices that can be programmed only once , devices that can be erased and then re-programmed using UV light , devices that can be (re)programmed using flash memory , and field-programmable gate arrays (FPGAs) which can be programmed at any time, including during operation. Current FPGAs can (as of 2016) implement

1560-463: A single card with some shared storage and processing. An example is Porto 's multi-application transport card, called Andante , that uses a chip in contact and contactless (ISO/IEC 14443 type B) mode. Like smart cards with contacts, contactless cards do not have a battery. Instead, they use a built-in inductor , using the principle of resonant inductive coupling , to capture some of the incident electromagnetic signal, rectify it, and use it to power

1638-532: A single die. A technique has been demonstrated to include microfluidic cooling on integrated circuits, to improve cooling performance as well as peltier thermoelectric coolers on solder bumps, or thermal solder bumps used exclusively for heat dissipation, used in flip-chip . The cost of designing and developing a complex integrated circuit is quite high, normally in the multiple tens of millions of dollars. Therefore, it only makes economic sense to produce integrated circuit products with high production volume, so

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1716-495: A single layer on one side of a chip of silicon in a flat two-dimensional planar process . Researchers have produced prototypes of several promising alternatives, such as: As it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules / chiplets , three-dimensional integrated circuits , package on package , High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce

1794-486: A six-pin device. Radios with the Loewe 3NF were less expensive than other radios, showing one of the advantages of integration over using discrete components , that would be seen decades later with ICs. Early concepts of an integrated circuit go back to 1949, when German engineer Werner Jacobi ( Siemens AG ) filed a patent for an integrated-circuit-like semiconductor amplifying device showing five transistors on

1872-654: A smart card usually implements some cryptographic algorithm . However, there are several methods of recovering some of the algorithm's internal state. Differential power analysis involves measuring the precise time and electric current required for certain encryption or decryption operations. This is most often used against public key algorithms such as RSA in order to deduce the on-chip private key, although some implementations of symmetric ciphers can be vulnerable to timing or power attacks as well. Smart cards can be physically disassembled by using acid, abrasives, or some other technique to obtain direct, unrestricted access to

1950-502: A transaction. They are often used when transactions must be processed quickly or hands-free, such as on mass transit systems, where a smart card can be used without even removing it from a wallet . The standard for contactless smart card communications is ISO/IEC 14443 . It defines two types of contactless cards ("A" and "B") and allows for communications at distances up to 10 cm (3.9 in) . There had been proposals for ISO/IEC 14443 types C, D, E, F and G that have been rejected by

2028-515: A variety of colors including pink, blue, and yellow. Student Passes could be bought at many schools and allowed students to pay $ 0.75 instead of the standard $ 2.25 fare. Disadvantages included the possibility that presentation of the passenger's student ID might be required in order for the pass to be honored and that the card was only valid on school days when school was in session (Monday through Friday, from 5:30 A.M. to 8:30 P.M., excluding holidays such as Thanksgiving Day, Labor Day, Memorial Day, and

2106-505: A year after Kilby, Robert Noyce at Fairchild Semiconductor invented the first true monolithic IC chip. More practical than Kilby's implementation, Noyce's chip was made of silicon , whereas Kilby's was made of germanium , and Noyce's was fabricated using the planar process , developed in early 1959 by his colleague Jean Hoerni and included the critical on-chip aluminum interconnecting lines. Modern IC chips are based on Noyce's monolithic IC, rather than Kilby's. NASA's Apollo Program

2184-602: Is being employed for efficiencies in public transit. The various standards emerging are local in focus and are not compatible, though the MIFARE Classic card from Philips has a large market share in the United States and Europe. In more recent times, Visa and MasterCard have agreed to standards for general "open loop" payments on their networks, with millions of cards deployed in the U.S., in Europe and around

2262-496: Is high because the IC's components switch quickly and consume comparatively little power because of their small size and proximity. The main disadvantage of ICs is the high initial cost of designing them and the enormous capital cost of factory construction. This high initial cost means ICs are only commercially viable when high production volumes are anticipated. An integrated circuit is defined as: A circuit in which all or some of

2340-690: Is obsolete. An early attempt at combining several components in one device (like modern ICs) was the Loewe 3NF vacuum tube first made in 1926. Unlike ICs, it was designed with the purpose of tax avoidance , as in Germany, radio receivers had a tax that was levied depending on how many tube holders a radio receiver had. It allowed radio receivers to have a single tube holder. One million were manufactured, and were "a first step in integration of radioelectronic devices". The device contained an amplifier , composed of three triodes, two capacitors and four resistors in

2418-510: The COVID-19 pandemic , demand for and usage of contactless credit and debit cards has increased, although coins and banknotes are generally safe and this technology will thus not reduce the spread of the virus. Contactless smart card readers use radio waves to communicate with, and both read and write data on a smart card. When used for electronic payment, they are commonly located near PIN pads , cash registers and other places of payment. When

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2496-476: The dual in-line package (DIP), first in ceramic and later in plastic, which is commonly cresol - formaldehyde - novolac . In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by

2574-465: The electronic wallet or "purse" that users of transit smart cards are used to. A quickly growing application is in digital identification cards. In this application, the cards are used for authentication of identity. The most common example is in conjunction with a PKI . The smart card will store an encrypted digital certificate issued from the PKI along with any other relevant or needed information about

2652-488: The non-recurring engineering (NRE) costs are spread across typically millions of production units. Modern semiconductor chips have billions of components, and are far too complex to be designed by hand. Software tools to help the designer are essential. Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems , including integrated circuits. The tools work together in

2730-498: The periodic table of the chemical elements were identified as the most likely materials for a solid-state vacuum tube . Starting with copper oxide , proceeding to germanium , then silicon , the materials were systematically studied in the 1940s and 1950s. Today, monocrystalline silicon is the main substrate used for ICs although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs , lasers , solar cells and

2808-544: The small-outline integrated circuit (SOIC) package – a carrier which occupies an area about 30–50% less than an equivalent DIP and is typically 70% thinner. This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline package (TSOP) packages became the most common for high pin count devices, though PGA packages are still used for high-end microprocessors . Ball grid array (BGA) packages have existed since

2886-416: The switching power consumption per transistor goes down, while the memory capacity and speed go up, through the relationships defined by Dennard scaling ( MOSFET scaling ). Because speed, capacity, and power consumption gains are apparent to the end user, there is fierce competition among the manufacturers to use finer geometries. Over the years, transistor sizes have decreased from tens of microns in

2964-503: The very large-scale integration (VLSI) of more than 10,000 transistors on a single chip. At first, MOS-based computers only made sense when high density was required, such as aerospace and pocket calculators . Computers built entirely from TTL, such as the 1970 Datapoint 2200 , were much faster and more powerful than single-chip MOS microprocessors such as the 1972 Intel 8008 until the early 1980s. Advances in IC technology, primarily smaller features and larger chips, have allowed

3042-413: The 1960s, the size, speed, and capacity of chips have progressed enormously, driven by technical advances that fit more and more transistors on chips of the same size – a modern chip may have many billions of transistors in an area the size of a human fingernail. These advances, roughly following Moore's law , make the computer chips of today possess millions of times the capacity and thousands of times

3120-425: The 1970s. Flip-chip Ball Grid Array packages, which allow for a much higher pin count than other package types, were developed in the 1990s. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over

3198-482: The 22 nm node (Intel) or 16/14 nm nodes. Mono-crystal silicon wafers are used in most applications (or for special applications, other semiconductors such as gallium arsenide are used). The wafer need not be entirely silicon. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium or copper) tracks deposited on them. Dopants are impurities intentionally introduced to

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3276-630: The ISO/IEC 14443 standard. The following tables list smart cards used for public transportation and other electronic purse applications. A related contactless technology is RFID (radio frequency identification). In certain cases, it can be used for applications similar to those of contactless smart cards, such as for electronic toll collection . RFID devices usually do not include writeable memory or microcontroller processing capability as contactless smart cards often do. There are dual-interface cards that implement contactless and contact interfaces on

3354-917: The International Organization for Standardization. An alternative standard for contactless smart cards is ISO/IEC 15693 , which allows communications at distances up to 50 cm (1.6 ft). Examples of widely used contactless smart cards are Seoul 's Upass (1996), Malaysia Touch 'n Go card (1997), Hong Kong 's Octopus card , Shanghai 's Public Transportation Card (1999), Paris 's Navigo card , Japan Rail 's Suica Card (2001), Singapore 's EZ-Link , Taiwan 's EasyCard , San Francisco Bay Area 's Clipper Card (2002), London 's Oyster card , Beijing 's Municipal Administration and Communications Card (2003), South Korea 's T-money , Southern Ontario 's Presto card , India 's More Card , Israel's Rav-Kav Card (2008), Melbourne 's Myki card and Sydney 's Opal card which predate

3432-399: The U.S. Payment occurs in a similar fashion to mag-stripe, without a PIN and often in off-line mode (depending on parameters of the terminal). The security level of such a transaction is better than a mag-stripe card, as the chip cryptographically generates a code which can be verified by the card issuer's systems. Contactless EMV cards have two interfaces (contact and contactless) and work as

3510-588: The USA. The AFC system replaced the CTA's tokens with magnetic-stripe stored-value cards printed on plastic or paper based on Cubic's earlier MetroCard implementation in New York City . All fare collection and payment equipment was designed to be retrofitted at a later date with smart card readers, a technology that was on the horizon. A small pilot program ("Chicago Gold") for reduced-fare disabled riders in 1999 led to

3588-430: The United States, and in 2006 in some parts of Europe and Asia (Singapore). In the U.S., contactless (non PIN ) transactions cover a payment range of ~$ 5–$ 100. In general there are two classes of contactless bank cards: magnetic stripe data (MSD) and contactless EMV . Contactless MSD cards are similar to magnetic stripe cards in terms of the data they share across the contactless interface. They are only distributed in

3666-471: The card at CTA vending machines or at select retail locations, and turnstiles or fareboxes deducted value from the card. Users usually registered cards with CTA and could receive a replacement in the event of theft, loss, or damage to the card. The blue-and-gold Chicago Card Plus was an account-based card. Users linked the card to either a credit card , debit card , or employer-provided transit benefit program. The cards could be set up as monthly passes or on

3744-423: The card holder. Examples include the U.S. Department of Defense (DoD) Common Access Card (CAC), and the use of various smart cards by many governments as identification cards for their citizens. When combined with biometrics, smart cards can provide two- or three-factor authentication. Smart cards are not always a privacy-enhancing technology, for the subject carries possibly incriminating information about him all

3822-603: The card's electronics. Since the start of using the Seoul Transportation Card , numerous cities have moved to the introduction of contactless smart cards as the fare media in an automated fare collection system. In a number of cases these cards carry an electronic wallet as well as fare products, and can be used for low-value payments. Starting around 2005, a major application of the technology has been contactless payment credit and debit cards. Some major examples include: Roll-outs started in 2005 in

3900-563: The cash fare increase went into effect, but Chicago Card users were charged the old fares. Benefits of the Chicago Card and the Chicago Card Plus included the following: In addition to the blue card, CTA also offered transit cards to students in both grammar schools and high schools. The passes included the phrase "STUDENT RIDING PERMIT", the year that the card was active, and the card's expiration date. The cards appeared in

3978-719: The circuit elements are inseparably associated and electrically interconnected so that it is considered to be indivisible for the purposes of construction and commerce. In strict usage, integrated circuit refers to the single-piece circuit construction originally known as a monolithic integrated circuit , which comprises a single piece of silicon. In general usage, circuits not meeting this strict definition are sometimes referred to as ICs, which are constructed using many different technologies, e.g. 3D IC , 2.5D IC , MCM , thin-film transistors , thick-film technologies , or hybrid integrated circuits . The choice of terminology frequently appears in discussions related to whether Moore's Law

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4056-479: The components of the electronic circuit are completely integrated". The first customer for the new invention was the US Air Force . Kilby won the 2000 Nobel Prize in physics for his part in the invention of the integrated circuit. However, Kilby's invention was not a true monolithic integrated circuit chip since it had external gold-wire connections, which would have made it difficult to mass-produce. Half

4134-473: The desktop Datapoint 2200 were built from bipolar integrated circuits, either TTL or the even faster emitter-coupled logic (ECL). Nearly all modern IC chips are metal–oxide–semiconductor (MOS) integrated circuits, built from MOSFETs (metal–oxide–silicon field-effect transistors). The MOSFET invented at Bell Labs between 1955 and 1960, made it possible to build high-density integrated circuits . In contrast to bipolar transistors which required

4212-418: The die must pass through the material electrically connecting the die to the package, through the conductive traces (paths) in the package, through the leads connecting the package to the conductive traces on the printed circuit board . The materials and structures used in the path these electrical signals must travel have very different electrical properties, compared to those that travel to different parts of

4290-541: The diffusion of impurities into silicon. A precursor idea to the IC was to create small ceramic substrates (so-called micromodules ), each containing a single miniaturized component. Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which seemed very promising in 1957, was proposed to the US Army by Jack Kilby and led to the short-lived Micromodule Program (similar to 1951's Project Tinkertoy). However, as

4368-537: The early 1970s to 10 nanometers in 2017 with a corresponding million-fold increase in transistors per unit area. As of 2016, typical chip areas range from a few square millimeters to around 600 mm , with up to 25 million transistors per mm . The expected shrinking of feature sizes and the needed progress in related areas was forecast for many years by the International Technology Roadmap for Semiconductors (ITRS). The final ITRS

4446-541: The entire die rather than being confined to the die periphery. BGA devices have the advantage of not needing a dedicated socket but are much harder to replace in case of device failure. Intel transitioned away from PGA to land grid array (LGA) and BGA beginning in 2004, with the last PGA socket released in 2014 for mobile platforms. As of 2018 , AMD uses PGA packages on mainstream desktop processors, BGA packages on mobile processors, and high-end desktop and server microprocessors use LGA packages. Electrical signals leaving

4524-580: The equivalent of millions of gates and operate at frequencies up to 1 GHz . Analog ICs, such as sensors , power management circuits , and operational amplifiers (op-amps), process continuous signals , and perform analog functions such as amplification , active filtering , demodulation , and mixing . ICs can combine analog and digital circuits on a chip to create functions such as analog-to-digital converters and digital-to-analog converters . Such mixed-signal circuits offer smaller size and lower cost, but must account for signal interference. Prior to

4602-545: The field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing a large transistor count . The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized

4680-412: The foundry model, fabless companies (like Nvidia ) only design and sell ICs and outsource all manufacturing to pure play foundries such as TSMC . These foundries may offer IC design services. The earliest integrated circuits were packaged in ceramic flat packs , which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to

4758-568: The highest-speed integrated circuits. It took decades to perfect methods of creating crystals with minimal defects in semiconducting materials' crystal structure . Semiconductor ICs are fabricated in a planar process which includes three key process steps – photolithography , deposition (such as chemical vapor deposition ), and etching . The main process steps are supplemented by doping and cleaning. More recent or high-performance ICs may instead use multi-gate FinFET or GAAFET transistors instead of planar ones, starting at

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4836-602: The idea to the public at the Symposium on Progress in Quality Electronic Components in Washington, D.C. , on 7 May 1952. He gave many symposia publicly to propagate his ideas and unsuccessfully attempted to build such a circuit in 1956. Between 1953 and 1957, Sidney Darlington and Yasuo Tarui ( Electrotechnical Laboratory ) proposed similar chip designs where several transistors could share

4914-421: The late 1990s, radios could not be fabricated in the same low-cost CMOS processes as microprocessors. But since 1998, radio chips have been developed using RF CMOS processes. Examples include Intel's DECT cordless phone, or 802.11 ( Wi-Fi ) chips created by Atheros and other companies. Modern electronic component distributors often further sub-categorize integrated circuits: The semiconductors of

4992-483: The line of passengers using the farebox; however, only one payment could be accepted at a time, eliminating this possible efficiency. The Go Lane card readers were removed starting in May 2010 and Chicago Card card readers were moved back to the main fare box. In February 2007, CTA announced that it had settled a class action lawsuit alleging there were not enough Chicago Cards available to meet demand on January 1, 2006, when

5070-433: The number of MOS transistors in an integrated circuit to double every two years, a trend known as Moore's law. Moore originally stated it would double every year, but he went on to change the claim to every two years in 1975. This increased capacity has been used to decrease cost and increase functionality. In general, as the feature size shrinks, almost every aspect of an IC's operation improves. The cost per transistor and

5148-461: The on-board microprocessor. Although such techniques obviously involve a fairly high risk of permanent damage to the chip, they permit much more detailed information (e.g. photomicrographs of encryption hardware) to be extracted. Short distance (≈10 cm. or 4″) is required for supplying power. The radio frequency, however, can be eavesdropped within several meters once powered-up. Microchip An integrated circuit ( IC ), also known as

5226-497: The project was gaining momentum, Kilby came up with a new, revolutionary design: the IC. Newly employed by Texas Instruments , Kilby recorded his initial ideas concerning the integrated circuit in July 1958, successfully demonstrating the first working example of an integrated circuit on 12 September 1958. In his patent application of 6 February 1959, Kilby described his new device as "a body of semiconductor material … wherein all

5304-495: The readers are used for public transit they are commonly located on fare boxes, ticket machines, turnstiles, and station platforms as a standalone unit. When used for security, readers are usually located to the side of an entry door. A contactless smart card is a card in which the chip communicates with the card reader through an induction technology similar to that of an RFID (at data rates of 106 to 848 kbit/s). These cards require only close proximity to an antenna to complete

5382-474: The size of the transistors. Such techniques are collectively known as advanced packaging . Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip modules while 3D describes approaches where dies are stacked in one way or another, such as package on package and high bandwidth memory. All approaches involve 2 or more dies in a single package. Alternatively, approaches such as 3D NAND stack multiple layers on

5460-427: The speed of the computer chips of the early 1970s. ICs have three main advantages over circuits constructed out of discrete components: size, cost and performance. The size and cost is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance

5538-624: The time. By employing contactless smart cards, that can be read without having to remove the card from the wallet or even the garment it is in, one can add even more authentication value to the human carrier of the cards. The Malaysian government uses smart card technology in the identity cards carried by all Malaysian citizens and resident non-citizens. The personal information inside the smart card (called MyKad ) can be read using special APDU commands. Smart cards have been advertised as suitable for personal identification tasks, because they are engineered to be tamper resistant . The embedded chip of

5616-777: The two-week winter break period including Christmas Day and New Years). The CTA announced it would replace the Chicago Card and other fare media with a new electronic fare payment system named Ventra . There are also reports that the Regional Transportation Authority is planning to require that Pace and Metra adopt that system. The transition to Ventra was completed in the summer of 2014. Contactless smart card There are two broad categories of contactless smart cards. Memory cards contain non-volatile memory storage components, and perhaps some specific security logic. Contactless smart cards contain read-only RFID called CSN (Card Serial Number) or UID, and

5694-400: The world of electronics . Computers, mobile phones, and other home appliances are now essential parts of the structure of modern societies, made possible by the small size and low cost of ICs such as modern computer processors and microcontrollers . Very-large-scale integration was made practical by technological advancements in semiconductor device fabrication . Since their origins in

5772-494: The world. Smart cards are being introduced in personal identification and entitlement schemes at regional, national, and international levels. Citizen cards, drivers’ licenses, and patient card schemes are becoming more prevalent. In Malaysia, the compulsory national ID scheme MyKad includes 8 different applications and is rolled out for 18 million users. Contactless smart cards are being integrated into ICAO biometric passports to enhance security for international travel. With

5850-401: Was a 16-transistor chip built by Fred Heiman and Steven Hofstein at RCA in 1962. General Microelectronics later introduced the first commercial MOS integrated circuit in 1964, a 120-transistor shift register developed by Robert Norman. By 1964, MOS chips had reached higher transistor density and lower manufacturing costs than bipolar chips. MOS chips further increased in complexity at

5928-441: Was developed at Fairchild Semiconductor by Federico Faggin in 1968. The application of MOS LSI chips to computing was the basis for the first microprocessors , as engineers began recognizing that a complete computer processor could be contained on a single MOS LSI chip. This led to the inventions of the microprocessor and the microcontroller by the early 1970s. During the early 1970s, MOS integrated circuit technology enabled

6006-514: Was issued in 2016, and it is being replaced by the International Roadmap for Devices and Systems . Initially, ICs were strictly electronic devices. The success of ICs has led to the integration of other technologies, in an attempt to obtain the same advantages of small size and low cost. These technologies include mechanical devices, optics, and sensors. As of 2018 , the vast majority of all transistors are MOSFETs fabricated in

6084-480: Was the largest single consumer of integrated circuits between 1961 and 1965. Transistor–transistor logic (TTL) was developed by James L. Buie in the early 1960s at TRW Inc. TTL became the dominant integrated circuit technology during the 1970s to early 1980s. Dozens of TTL integrated circuits were a standard method of construction for the processors of minicomputers and mainframe computers . Computers such as IBM 360 mainframes, PDP-11 minicomputers and

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