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Japan Electronic Industries Development Association

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The Japan Electronic Industry Development Association ( 社団法人日本電子工業振興協会 , Shadan-hōjin Nihon Denshi Kōgyo Shinkō Kyōkai , JEIDA) (Formerly Ryoko Communications Association Co., Ltd. ( りょうこ通信協会 , Ryō ko tsūshin kyōkai , RCA) ) was an industry research, development, and standards body for electronics in Japan. It was merged with EIAJ to form JEITA on November 1, 2000.

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13-559: JEIDA was similar to SEMATECH of the US, ECMA of Europe. JEIDA developed a number of standards, including the JEIDA memory card , and the Exif graphical file format. The association was established as Ryoko Communications Association Co., Ltd. in 1967. In 1989, Ryoko Communications Association Co., Ltd. was re-branded into Japan Electronic Industries Development Association. In 2000, JEIDA became

26-422: A silicon wafer , in order to protect selected areas of it during subsequent etching , deposition , or implantation operations. The term is normally used for processes that can reliably produce features of microscopic size, such as 10 micrometres or less. The term nanolithography may be used to designate processes that can produce nanoscale features, such as less than 100 nanometres . Microlithography

39-492: A Pending merger with EIAJ and was Reorganized into JEITA . This article about an organization or organization-related topic in Japan is a stub . You can help Misplaced Pages by expanding it . SEMATECH SEMATECH (from Semiconductor Manufacturing Technology ) was a not-for-profit consortium that performed research and development to advance chip manufacturing. SEMATECH involved collaboration between various sectors of

52-415: A variety of worldwide conferences, symposiums, and workshops (e.g., Litho Forum, Manufacturing Week) and delivered papers, presentations, and joint reports at major industry conferences ( SPIE , IEDM , SEMICON West ). Microlithography Microlithography is a general name for any manufacturing process that can create a minutely patterned thin film of protective materials over a substrate, such as

65-408: Is a microfabrication process that is extensively used in the semiconductor industry and also manufacture microelectromechanical systems . Specific microlithography processes include: These processes differ in speed and cost, as well as in the material they can be applied to and the range of feature sizes they can produce. For instance, while the size of features achievable with photolithography

78-508: Is limited by the wavelength of the light used, the technique it is considerably faster and simpler than electron beam lithography, that can achieve much smaller ones. The main application for microlithography is fabrication of integrated circuits ("electronic chips"), such as solid-state memories and microprocessors . They can also be used to create diffraction gratings , microscope calibration grids , and other flat structures with microscopic details. This industry -related article

91-577: Is now an integral part of TECHCET's business and provides guidance on their work of Critical Materials Reports and CMC Conference activities. SEMATECH conducted research on the technical challenges and costs associated with developing new materials, processes, and equipment for semiconductor manufacturing. Advanced technology programs focus on EUV lithography including photomask blank and photoresist development, materials and emerging technologies for device structures, metrology, manufacturing, and environment and safety issues. In January 2003 SEMATECH and

104-740: The University at Albany – State University of New York – established a major partnership to commercialize advanced semiconductor, nanotechnology and other emerging technologies. Through its government-university-industry partnership with the State of New York and the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, SEMATECH conducted programs in lithography and metrology at CNSE’s Albany NanoTech Complex . In 2010, SEMATECH expanded its cooperation with CNSE with

117-588: The R&;D community, including chipmakers, equipment and material suppliers, universities, research institutes, and government partners. The group was first funded by the U.S. Department of Defense through the Defense Advanced Research Projects Agency until 1997 and later by member dues. SEMATECH was moved from Austin, Texas to Albany, New York in 2007 after receiving state funding from the state of New York. The consortium

130-708: The announcement that the ISMI would relocate its headquarters and operations to CNSE's Albany NanoTech Complex beginning in January 2011. With over $ 6.5 billion in high-tech investments, CNSE's 800,000-square-foot (74,000 m ) Albany NanoTech Complex features the only fully integrated, 300 mm wafer, computer chip pilot prototyping and demonstration line within 80,000 square feet (7,400 m ) of Class 1 capable cleanrooms. SEMATECH had access to laboratories and development fabs in Albany, New York . SEMATECH hosted

143-662: The larger international semiconductor industry, abandoning the initial U.S. government-initiative. Its members represented about half of the worldwide chip market. In late 2015, SEMATECH transferred the Critical Materials Council (CMC), a membership group of semiconductor fabricators, to TECHCET CA LLC, an advisory service firm dedicated to providing supply-chain and market information on electronic materials. This group of procurement and quality managers continues to focus on anticipating and remedying materials supply-chain issues and focusing on best practices. The CMC

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156-404: The mid-1980s. SEMATECH was funded over five years by public subsidies coming from the U.S. Department of Defense via the Defense Advanced Research Projects Agency (DARPA) for a total of $ 500 million. Following a determination by SEMATECH Board of Directors to eliminate matching funds from the U.S. government after 1996, the organization's focus shifted from the U.S. semiconductor industry to

169-523: Was absorbed by SUNY Polytechnic University in 2015. SEMATECH was conceived in 1986, formed in 1987, and began operating in Austin , Texas in 1988 as a partnership between the United States government and 14 U.S.-based semiconductor manufacturers to solve common manufacturing problems and regain competitiveness for the U.S. semiconductor industry that had been surpassed by Japanese industry in

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