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92-527: The TMS 1000 is used in Texas Instruments' own Speak & Spell educational toy, the Big Trak programmable toy vehicle and in the electronic game Simon . The Smithsonian Institution says TI engineers Gary Boone and Michael Cochran succeeded in creating the first microcontroller in 1971. The TMS1802NC was a single-chip microcontroller which was announced September 17, 1971 and implemented

184-598: A QIL package , has the same dimensions as a DIL package, but the leads on each side are bent into an alternating zigzag configuration so as to fit four lines of solder pads (instead of two with a DIL). The QIL design increased the spacing between solder pads without increasing package size, for two reasons: Commonly found DIP packages that conform to JEDEC standards use an inter-lead spacing (lead pitch) of 0.1 inches (2.54 mm) (JEDEC MS-001BA). Row spacing varies depending on lead counts, with 0.3 in. (7.62 mm) (JEDEC MS-001) or 0.6 inch (15.24 mm) (JEDEC MS-011)

276-415: A minicomputer . Some weeks later the processed data was returned and required significant hand editing to fix the voicing errors which had occurred during the process. The data rate was so radically cut that all of the words needed some editing. In some cases, this was fairly simple, but some words were unintelligible and required days of work and others had to be completely scrapped. The stored data were for

368-580: A PC Card named "Speak-2-Me-2" which was installed into the battery compartment of the Speak & Spell and connected via cable to a TRS-80 . East Coast Micro Products offered hardware to interface 6502 -based computers such as the Commodore 64 and Apple IIe with the Speak & Spell. A program called "S.peek.uP" was marketed which could control this hardware. The February 1983 issue of Computers & Electronics contained instructions for interfacing

460-401: A Speak & Spell with a Sinclair ZX-80 a Sinclair ZX-81 , or a Timex 1000 . Texas Instruments itself later adapted the Speak & Spell's technology into a speech synthesizer accessory for its popular TI-99/4A computer. The Speak & Spell (as well as the " Speak & Math " and " Speak & Read ") are emulated, running the original code, by MESS . A number of simulations of

552-399: A circular window of clear quartz over the chip die to allow the part to be erased by ultraviolet light . Often, the same chips were also sold in less expensive windowless PDIP or CERDIP packages as one-time programmable (OTP) versions. Windowed and windowless packages were also used for microcontrollers, and other devices, containing EPROM memory. Windowed CERDIP-packaged EPROMs were used for

644-620: A considerable degree to its prior Speak & Spell form. This version re-adopted the handle-on-top look of the previous models and resumed the use of the original cartridges. The use of the LCD screen and the QWERTY keyboard were retained; however, the keyboard gained an additional 5 letters (6 in some regions) to correspond with letters requiring diacritics . It was marketed first in Spanish as El Loro Parlanchín ( The Chatty Parrot ), and then later in

736-471: A few thousand items sold per year). All internal data paths of the processor were 4 bits wide. Program ROM and data RAM were separately addressed as in a Harvard architecture ; this became a typical characteristic of microcontrollers by many other manufacturers. The ALU had a carry flag to indicate overflow and facilitate multiple precision arithmetic. On-chip RAM was addressed by X and Y registers, where Y had 4 bits and X had either 2 or 3 bits depending on

828-601: A four-function calculator. The TMS1802NC, despite its designation, was not part of the TMS 1000 series; it was later redesignated TMS0102 as part of the TMS 0100 series, which was used in the TI Datamath calculator and the Sinclair Executive calculator. The later TMS 1000 series went on the market in 1974. TI stressed the 4-bit TMS 1000 for use in pre-programmed embedded applications. A computer-on-a-chip combines

920-548: A hollow plastic box with the bottom/back open, filled (around the contained electronic components) with a hard translucent epoxy material from which the leads emerge. Others, such as DIP switches, are composed of two (or more) plastic housing parts snapped, welded, or glued together around a set of contacts and tiny mechanical parts, with the leads emerging through molded-in holes or notches in the plastic. Several DIP variants for ICs exist, mostly distinguished by packaging material: EPROMs were sold in ceramic DIPs manufactured with

1012-409: A library of over 100,000 random and preprogrammed problems. It was regarded as the spiritual successor to TI's earlier DataMan series, with the difference mainly relating to the addition of speech synthesizing software and the visual display. The Speak & Math was only released to American and British markets. In 1982, a compact version of the Speak & Math was developed contemporaneously with

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1104-476: A limitation in the use of integrated circuits . Increasingly complex circuits required more signal and power supply leads (as observed in Rent's rule ); eventually microprocessors and similar complex devices required more leads than could be put on a DIP package, leading to development of higher-density chip carriers . Furthermore, square and rectangular packages made it easier to route printed-circuit traces beneath

1196-520: A modified "bent" circuit instrument (see below). Artists like Kraftwerk have used the musical samples from the Speak & Spell's opening sequence in their songs, whereas most employed the non-musical vocal portions of the Speak & Spell to create vocal parts in their songs. Speak & Spell speech synthesis has featured in genres such as alternative rock (e.g. Beck , Limp Bizkit ), electronic music (e.g. Jean Michel Jarre , Röyksopp , and Robyn ), synthpop (e.g. Orchestral Manoeuvres in

1288-553: A non-replaceable 10-year lithium battery. DIP header blocks on to which discrete components could be soldered were used where groups of components needed to be easily removed, for configuration changes, optional features or calibration. The original dual-in-line package was invented by Bryant "Buck" Rogers in 1964 while working for Fairchild Semiconductor. The first devices had 14 pins and looked much like they do today. The rectangular shape allowed integrated circuits to be packaged more densely than previous round packages. The package

1380-474: A redesign of the faceplate graphics. In 1988 the Super Speak & Read was released as a major redesign to feature a suitcase-like flip-open appearance. Cartridges were redesigned to be thinner and of a different shape, bearing some resemblance to the cartridges of TI's Touch & Discover line. Additionally, the keyboard was removed completely and a matrix of membrane buttons took its place similarly to

1472-570: A second bend in the leads to flatten them parallel to the bottom plane of the plastic housing. The SOJ (Small Outline J-lead) and other SMT packages with "SOP" (for "Small Outline Package") in their names can be considered further relatives of the DIP, their original ancestor. SOIC packages tend to have half the pitch of DIP, and SOP are half that, a fourth of DIP. (0.1"/2.54 mm, 0.05"/1.27 mm, and 0.025"/0.635 mm, respectively) Pin grid array (PGA) packages may be considered to have evolved from

1564-471: A slot near the battery compartment in order to introduce new software libraries. Word and game lists are of different lengths depending upon the cartridge and the word lists in models marketed for different languages reflect the language marketed for. Separate word lists also exist for regional variants such as the American and British English versions. The word list used in each of the regional models reflects

1656-422: A tin-, silver-, or gold-plated lead frame that supports the device die and provides connection pins. Some types of IC are made in ceramic DIP packages, where high temperature or high reliability is required, or where the device has an optical window to the interior of the package. Most DIP packages are secured to a PCB by inserting the pins through holes in the board and soldering them in place. Where replacement of

1748-421: A year and a week number), sometimes where it was made, and other proprietary information (perhaps revision numbers, manufacturing plant codes, or stepping ID codes.) The necessity of laying out all of the leads in a basically radial pattern in a single plane from the die perimeter to two rows on the periphery of the package is the main reason that DIP packages with higher lead counts must have wider spacing between

1840-434: Is always even. For 0.3 inch spacing, typical lead counts are 8, 14, 16, and 20; less common are 4, 6, 18, 24, and 28 lead counts. To have an even number of leads some DIPs have unused not connected (NC) leads to the internal chip, or are duplicated, e.g. two ground pins. For 0.6 inch spacing, typical lead counts are 24, 28, 32, and 40; less common are 36, 42, 48, 52, and 64 lead counts. Some microprocessors, such as

1932-420: Is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket. The dual-inline format was invented by Don Forbes, Rex Rice and Bryant Rogers at Fairchild R&D in 1964, when the restricted number of leads available on circular transistor-style packages became

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2024-473: Is not as popular as the DIP, but has been used for packaging RAM chips and multiple resistors with a common pin. As compared to DIPs with a typical maximum pin count of 64, SIPs have a typical maximum pin count of 24 with lower package costs. One variant of the single in-line package uses part of the lead frame for a heat sink tab. This multi-leaded power package is useful for such applications as audio power amplifiers, for example. The QIP, sometimes called

2116-470: The BIOS ROM of many early IBM PC clones with an adhesive label covering the window to prevent inadvertent erasure through exposure to ambient light. Molded plastic DIPs are much lower in cost than ceramic packages; one 1979 study showed that a plastic 14 pin DIP cost around US$ 0.063 and a ceramic package cost US$ 0.82. A single in-line package ( SIP or SIL package ) has one row of connecting pins. It

2208-467: The Motorola 68000 and Zilog Z180 , used lead counts as high as 64; this is typically the maximum number of leads for a DIP package. As shown in the diagram, leads are numbered consecutively from Pin 1. When the identifying notch in the package is at the top, Pin 1 is the top left corner of the device. Sometimes Pin 1 is identified with an indent or paint dot mark. For example, for a 14-lead DIP, with

2300-473: The 1980s as the Electronic Voice Alert . Speech synthesis data ( phoneme data ) for the spoken words were stored on a pair of 128 Kbit metal gate PMOS ROMs. 128 Kbit was at the time the largest capacity ROM in use. Additional memory module cartridges could be interchangeably plugged into a slot in the battery compartment and selected via a button on the keyboard. The technique used to create

2392-447: The 1990s, and still continue to be used today. Because some modern chips are available only in surface-mount package types, a number of companies sell various prototyping adapters to allow those surface-mount devices (SMD) to be used like DIP devices with through-hole breadboards and soldered prototyping boards (such as stripboard and perfboard ). (SMT can pose quite a problem, at least an inconvenience, for prototyping in general; most of

2484-456: The DIP. PGAs with the same 0.1 inches (2.54 mm) pin centers as most DIPs were popular for microprocessors from the early to mid-1980s through the 1990s. Owners of personal computers containing Intel 80286 through P5 Pentium processors may be most familiar with these PGA packages, which were often inserted into ZIF sockets on motherboards . The similarity is such that a PGA socket may be physically compatible with some DIP devices, though

2576-461: The DIP64 used for the Motorola 68000 CPU) has long leads inside the package between pins and the die, making such a package unsuitable for high speed devices. Some other types of DIP devices are built very differently. Most of these have molded plastic housings and straight leads or leads that extend directly out of the bottom of the package. For some, LED displays particularly, the housing is usually

2668-595: The Dark , Plastics , Erasure , and Freezepop ), trance music (e.g. Sōta Fujimori ), electropop (e.g. TLC ), Christian rock (e.g. Resurrection Band , Family Force 5 ), pop (e.g. Cheetah Girls ), and hip hop (e.g. Naya Rivera ). The English synthpop band Depeche Mode 's 1981 debut album, Speak & Spell , is named after it. Some musicians have also used modified " circuit bent " (where electronic circuits are customised to create new effects) Speak & Spell units in their compositions. By opening

2760-515: The Dictée Magique again. The Super Speak & Spell was released in 1989 with a number of major changes. The display screen was changed to an LCD screen instead of the former VFD screen. The keyboard layout was also altered to match the standard QWERTY keyboard rather than the ABC keyboard. The general structure of the console was also altered so that the handle which had come at the top of

2852-647: The Extra-Terrestrial . Speak & Spells also make appearances in movies such as Pixar's Toy Story and Toy Story 2 (where the game device is a character named "Mr. Spell"), Bride of Chucky (where the possessed doll, Chucky plays with one), in Poltergeist III (used by the character Carol Anne Freeling), and in the music videos for the songs " Playgirl " by the synthpop music group Ladytron , " Fireflies " by Owl City and " Dare " by Gorillaz . The speak and spell voice also appears in

Texas Instruments TMS1000 - Misplaced Pages Continue

2944-482: The IC die inside. Plastic DIP (PDIP) packages are usually sealed by fusing or cementing the plastic halves around the leads, but a high degree of hermeticity is not achieved because the plastic itself is usually somewhat porous to moisture and the process cannot ensure a good microscopic seal between the leads and the plastic at all points around the perimeter. However, contaminants are usually still kept out well enough that

3036-554: The NMOS and PMOS parts, but some CMOS parts could be run as fast as 6 microseconds. The internal oscillator gave an effective clock speed of around 0.3 megahertz. The TMS1000 parts were packaged in through-hole dual in-line packages with 28 or 40 pins, but some models for prototyping were in 64-pin packages. All versions had a temperature range of 0 to 70 degrees C. Since these were intended as single-chip embedded systems, no special support chips (such as UARTs ) were specifically made in

3128-466: The Ready... Set... Read! (sharing a highly similar design layout ) and later Magic Reading Desk (featuring a modified Ready... Set... Read! layout ) are considered the Speak & Read's spiritual successors . Both Ready... Set... Read! and Magic Reading Desk cartridges are identical in design to the Super Speak & Read's cartridges. The Speak & Math (sold as "Speak & Maths" in some countries)

3220-457: The SMT package that most resembles a typical DIP, appears essentially the same, notwithstanding size scale, except that after being bent down the leads are bent upward again by an equal angle to become parallel with the bottom plane of the package.) In ceramic (CERDIP) packages, an epoxy or grout is used to hermetically seal the two halves together, providing an air and moisture tight seal to protect

3312-439: The Speak & Spell (not emulations, as they don't run the original code) have shown up online in recent years with varying degrees of functionality. Often programmed for Flash , these are often the result of nostalgic sentiment for the 1980s. Examples of simulators generally available online include: The Speak & Spell has been employed in recent years in commercial music as an instrument either in its original form or as

3404-641: The Speak & Spell Compact. This version was only released in France as Les Maths Magique (lit. The Magical Math). A redesigned version was developed in 1985 for British markets under the name of Maths marvel. This was later released in Italian as Dotto Conta-Parla, in French as le Calcul magique (lit. Magical Calculator), and in German as Mathe-Fix. The Speak & Math was very minutely redesigned in 1986, under

3496-432: The Speak & Spell line. Examples include: A number of TI's other game lines produced during the period when it was producing Speak & Spell games bore similar logically conjunctive titles and employed similar technology although they did not involve the use of Solid State Speech technology. Such games included: Dual in-line package In microelectronics , a dual in-line package ( DIP or DIL )

3588-505: The Speak & Spell without making modifications if more than 3 keys in the same row are depressed simultaneously; however, within the circuit bending culture, emphasis is given to the fact that these units are being used as instruments and thus externally manipulable components are often accentuated. Great attention may be given to enhancing the visual aesthetics of the units by adding decorations and repainting "bent" Speak & Spells, and these units have been traded and sold online and within

3680-475: The Speak & Spell's case, cross-wiring terminals , and installing electronic components such as switches and potentiometers , amateur hobbyists purposely disrupt the normal functioning of the Speak & Spell's membrane keyboard matrix circuit in order to create new sounds. These modifications act to overwhelm the unit's keyboard switch matrix to produce an effect known in the field of electronics as key jamming or ghosting . This effect can be triggered in

3772-425: The Speak & Spell; however, the updated version introduced a number of changes. Primary among these is the replacement of the original microprocessor and classic synthesized voice chip (TMS1000 and TMC0280 respectively) with recorded dialog that is processed to sound as if it's synthesized. It also offers on-device instructions that weren't available on previous versions. The 2019 model Speak & Spell also replaces

Texas Instruments TMS1000 - Misplaced Pages Continue

3864-561: The TMS 1000 family. Speak %26 Spell (toy) The Speak & Spell line is a series of electronic hand-held child computers by Texas Instruments that consisted of a TMC0280 linear predictive coding speech synthesizer , a keyboard, and a receptor slot to receive one of a collection of ROM game library modules. The first Speak & Spell was introduced at the summer Consumer Electronics Show in June ;1978 (46 years ago)  ( 1978-06 ) , making it one of

3956-507: The United States as the Super Speak & Spell, in French as La Super Dictée Magique, and in Italian as Grillo Parlante Più ("Speaking Cricket Plus"). In 1992, a third redesign of the Super Speak & Spell was made for the Spanish market only. The new version was nearly identical to the prior El Loro Parlanchín save for the name which became El Loro Profesor ( Professor Parrot ). In 2019, Basic Fun acquired rights to manufacture

4048-580: The United States, the 1980 release was marketed in the United Kingdom under the same name, in German as the Buddy (employing an umlaut in place of the Speak & Spell's apostrophe ), and in French as La Dictée Magique ("The Magical Dictation"). In 1982, the Speak & Spell Compact was released at about half the size of the Speak & Spell and lacking the VFD screen. The Speak & Spell Compact

4140-649: The VFD screen with a segmented LCD screen. The use of removable cartridges has also been eliminated. The Speak & Spell used the first single-chip voice synthesizer, the TMC0280, later known as the TI TMS5100, which utilized a 10th-order linear predictive coding (LPC) model by using pipelined electronic DSP logic. A variant of this chip with a very similar voice was eventually used in certain Chrysler vehicles in

4232-413: The alphabet, slightly askew, in the form of a Caesar cipher . In the game, both C and D and P and Q match up and run in opposite directions: Several commercial retailers offered hardware and software which allowed home computers to interface with the Speak & Spell's hardware and access its capabilities, and Larry Dighera was first to reveal how that might be accomplished. Percom Data Company offered

4324-531: The art, this advantage of DIPs is rapidly losing importance as well. Through the 1990s, devices with fewer than 20 leads were manufactured in a DIP format in addition to the newer formats. Since about 2000, newer devices are often unavailable in the DIP format. DIPs can be mounted either by through-hole soldering or in sockets. Sockets allow easy replacement of a device and eliminates the risk of damage from overheating during soldering. Generally sockets were used for high-value or large ICs, which cost much more than

4416-442: The battery receptacle to provide new solid-state libraries and new games. This represented the first time an educational toy utilized speech that was not recorded on tape or phonograph record (as with Mattel 's See 'n Say line or the earlier Chatty Cathy dolls). The original Speak & Spell was the first of a three-part talking educational toy series that also included Speak & Read and Speak & Math . This series

4508-411: The characteristics of SMT that are advantages for mass production are difficulties for prototyping.) For programmable devices like EPROMs and GALs , DIPs remained popular for many years due to their easy handling with external programming circuitry (i.e., the DIP devices could be simply plugged into a socket on the programming device.) However, with In-System Programming (ISP) technology now state of

4600-634: The circuit bender community. Examples of artists who have used circuit-bent Speak & Spells in their compositions include Beck , CocoRosie , Eisbrecher , Experimental Audio Research , Fantômas , Scrabbel, Venetian Snares , and Claude Woodward The Sonic Manipulator. The Speak & Spell features in various electronics museums such as the Computer History Museum and the Smithsonian National Museum of American History due to its seminal influence in

4692-431: The device can operate reliably for decades with reasonable care in a controlled environment. Inside the package, the lower half has the leads embedded, and at the center of the package is a rectangular space, chamber, or void into which the IC die is cemented. The leads of the package extend diagonally inside the package from their positions of emergence along the periphery to points along a rectangular perimeter surrounding

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4784-406: The device. Typical cure cycles for the resins are less than 2 minutes and a single cycle may produce hundreds of devices. The leads emerge from the longer sides of the package along the seam, parallel to the top and bottom planes of the package, and are bent downward approximately 90 degrees (or slightly less, leaving them angled slightly outward from the centerline of the package body). (The SOIC ,

4876-450: The die, tapering as they go to become fine contacts at the die. Ultra-fine bond wires (barely visible to the naked human eye) are welded between these die periphery contacts and bond pads on the die itself, connecting one lead to each bond pad, and making the final connection between the microcircuits and the external DIP leads. The bond wires are not usually taut but loop upward slightly to allow slack for thermal expansion and contraction of

4968-417: The earliest handheld electronic devices with a visual display to use interchangeable game cartridges . The company Basic Fun brought back the classic Speak & Spell in 2019 with some minor changes. The Speak & Spell was named an IEEE Milestone in 2009. The Speak & Spell was created by a small team of engineers led by Paul Breedlove, himself an engineer, with Texas Instruments (TI) during

5060-519: The field of modern speech synthesis . The Speak & Spell is also featured in the Game On exhibition as an example of a handheld video game . The Speak & Spell has shown up in various television shows, films, and game shows. A Speak & Spell has a prominent role as a key component of the alien creature's homebuilt interstellar communicator in Steven Spielberg 's 1982 film E.T.

5152-416: The informal term "dead bug style" for the method. The body (housing) of a DIP containing an IC chip is usually made from molded plastic or ceramic. The hermetic nature of a ceramic housing is preferred for extremely high reliability devices. However, the vast majority of DIPs are manufactured via a thermoset molding process in which an epoxy mold compound is heated and transferred under pressure to encapsulate

5244-444: The late 1970s. Development began in 1976 with an initial budget of $ 25,000, as an outgrowth of TI 's research into speech synthesis . The completed proof version of the first console utilized TI's trademarked Solid State Speech technology to store full words in a solid state format similar to the manner in which calculators of the time stored numbers. Additional purchased cartridges (called expansion modules) could be inserted through

5336-443: The lead rows, and it effectively limits the number of leads which a practical DIP package may have. Even for a very small die with many bond pads (e.g. a chip with 15 inverters, requiring 32 leads), a wider DIP would still be required to accommodate the radiating leads internally. This is one of the reasons that four-sided and multiple rowed packages, such as PGAs , were introduced (around the early 1980s). A large DIP package (such as

5428-403: The limited number of package pins were needed to access off-chip program memory. One version had special outputs for driving a vacuum fluorescent display , and a programmable logic array useful for driving seven segment displays . Four input lines were provided for purposes such as sensing keyboard inputs, and a varying number of output lines were provided to control external devices, or to scan

5520-406: The linguistic aspect of the games played on the Speak & Spell are of central importance to Speak & Spell titles, separate cartridge libraries were developed for English (including American and British ), Japanese, German, French, Italian, and Spanish markets. Beyond the natural disinclination of consumers to purchase games in foreign languages, however, regional lockout does not prevent

5612-450: The main Speak & Spell line, and they could be physically inserted into units from the wrong line; however, they did not function except in members of their own line. The Speak & Read was designed to focus on reading comprehension in children of ages 4–8 with a library of over 250 basic words. The Speak & Read was very minutely redesigned in 1986, under the same name, with the new version representing nothing more substantial than

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5704-408: The materials; if a single bond wire breaks or detaches, the entire IC may become useless. The top of the package covers all of this delicate assemblage without crushing the bond wires, protecting it from contamination by foreign materials. Usually, a company logo, alphanumeric codes and sometimes words are printed on top of the package to identify its manufacturer and type, when it was made (usually as

5796-405: The microprocessor core (CPU), memory, and I/O ( input/output ) lines onto one chip . The computer-on-a-chip patent, called the "microcomputer patent" at the time, U.S. patent 4,074,351 , was awarded to Gary Boone and Michael J. Cochran of TI. Aside from this patent, the standard meaning of microcomputer is a computer using one or more microprocessors as its CPU(s), while the concept defined in

5888-456: The most common. Less common standardized row spacings include 0.4 inch (10.16 mm) (JEDEC MS-010) and 0.9 inch (22.86 mm), as well as a row spacing of 0.3 inch, 0.6 inch or 0.75 inch with a 0.07 inch (1.778 mm) lead pitch. The former Soviet Union and Eastern bloc countries used similar packages, but with a metric pin-to-pin spacing of 2.5 mm rather than 0.1 inches (2.54 mm). The number of leads

5980-401: The notch at the top, the left leads are numbered from 1 to 7 (top to bottom) and the right row of leads are numbered 8 to 14 (bottom to top). Leads are skipped on some DIP devices (e.g. segmented LED displays , relays, or devices that replace leads with a heat sink fin). The remaining leads are numbered as if all positions had leads. In addition to providing for human visual identification of

6072-421: The orientation of the package, the notch allows automated chip-insertion machinery to confirm correct orientation of the chip by mechanical sensing. The SOIC (Small Outline IC), a surface-mount package which is currently very popular, particularly in consumer electronics and personal computers, is essentially a shrunk version of the standard IC PDIP, the fundamental difference which makes it an SMT device being

6164-411: The original Speak & Spell was redesigned to give it a membrane keyboard in place of raised buttons. This version was nearly identical to the first release and with backward compatible cartridge recognition common to all Speak & Spells except the first version of the Super Speak & Spell, the entire library of cartridges from the original release were available to the 1980 release. Outside of

6256-602: The package. DIP packages have been mostly displaced by surface-mount package types, which avoid the expense of drilling holes in a PCB and which allow higher density of interconnections. DIPs are commonly used for integrated circuits (ICs). Other devices in DIP packages include resistor networks, DIP switches , LED segmented and bar graph displays, and electromechanical relays . DIP connector plugs for ribbon cables are common in computers and other electronic equipment. Dallas Semiconductor manufactured integrated DIP real-time clock (RTC) modules which contained an IC chip and

6348-729: The packages. A DIP is usually referred to as a DIP n , where n is the total number of pins, and sometimes appended with the row-to-row package width "N" for narrow (0.3") or "W" for wide (0.6"). For example, a microcircuit package with two rows of seven vertical leads would be a DIP14 or DIP14N. The photograph at the upper right shows three DIP14 ICs. Common packages have as few as three and as many as 64 leads. Many analog and digital integrated circuit types are available in DIP packages, as are arrays of transistors, switches, light emitting diodes, and resistors. DIP plugs for ribbon cables can be used with standard IC sockets. DIP packages are usually made from an opaque molded epoxy plastic pressed around

6440-437: The parts is necessary, such as in test fixtures or where programmable devices must be removed for changes, a DIP socket is used. Some sockets include a zero insertion force (ZIF) mechanism. Variations of the DIP package include those with only a single row of pins, e.g. a resistor array , possibly including a heat sink tab in place of the second row of pins, and types with four rows of pins, two rows, staggered, on each side of

6532-516: The patent is more akin to a microcontroller. The TMS1000 family eventually included variants in both the original PMOS logic and also in NMOS and CMOS . Product variations included different sizes of ROM and RAM, different I/O counts, and ROMless versions intended for development or for use with external ROM. The original TMS1000 had 1024 x 8 bits of ROM, 64 x 4 bits of RAM, and 23 input/output lines. The TMS1000 family used mask-programmed ROM . Once

6624-455: The position-sensitive "keyboard" of the Touch & Discover consoles. Each cartridge came with a work-booklet that was laid out in an open position in the center of the Super Speak & Read. As questions were asked, the player pressed the appropriate portion of the work-booklet to depress the membrane button beneath. This was the last member of the Speak & Read line under this name; however,

6716-543: The recommendations of educators in each country. The English, French, German and Italian versions were all created by a team of non-specialists, in TI's plant near Antibes, France, under the watchful eye of Larry Brantingham who had patented the underlying technology. Examples of educational games that could be played using Speak & Spell cartridges include: The "Secret Code" mini-game encrypted or decrypted "words" (really, any string of up to 8 letters) by matching up two sets of

6808-607: The rows of a keyboard matrix circuit . PMOS versions ran on -9 or -15 volts and consumed around 6 mA, Output logic levels were therefore not compatible with TTL logic . The NMOS and CMOS parts ran on a TTL-style +5 volts and could interoperate with 5 volt logic. Instruction sets varied slightly by model, with 43 instructions in the basic set and 54 available in some family members; instructions were 8 bits long. BCD arithmetic instructions were provided, but no instructions were available for logical AND or OR of registers. Each instruction took between 10 and 15 microseconds to execute on

6900-409: The same name, with the new version representing nothing more substantial than a redesign of the faceplate graphics. In 1990 the Super Speak & Math was released as a major redesign similar to the first version of the Super Speak & Spell. As with the Super Speak & Spell, the display screen of the Super Speak & Math was changed to an LCD screen instead of the former VFD screen. The keyboard

6992-435: The screen in prior Speak & Spells was now found on the bottom of the toy and ergonomic features were added to the shape. Furthermore, game cartridges for the Super Speak & Spell were changed so that they were incompatible with prior Speak & Spells and the cartridge slot was similarly altered to prevent backward compatibility. The following year the Super Speak & Spell was again majorly redesigned to return to

7084-512: The size and weight of systems. DIP chips are still popular for circuit prototyping on a breadboard because of how easily they can be inserted and used there. DIPs were the mainstream of the microelectronics industry in the 1970s and 1980s. Their use has declined in the first decade of the 21st century due to the emerging new surface-mount technology (SMT) packages such as plastic leaded chip carrier (PLCC) and small-outline integrated circuit (SOIC), though DIPs continued in extensive use through

7176-455: The size of RAM on the part. The program counter was 6 bits wide, with "page" and "chapter" registers to address up to 2 KB of ROM program memory. No stack was provided, but a register was provided to store the program counter and carry flag to allow for one level of subroutine (some members of the family allowed for 2 or 3 levels). No interrupt facility was provided. Some models had as few as 4 I/O lines because they had no on-chip ROM and

7268-471: The socket. Where devices would be frequently inserted and removed, such as in test equipment or EPROM programmers, a zero insertion force socket would be used. DIPs are also used with breadboards, a temporary mounting arrangement for education, design development or device testing. Some hobbyists, for one-off construction or permanent prototyping, use point-to-point wiring with DIPs, and their appearance when physically inverted as part of this method inspires

7360-681: The specific words and phrases used in the Speak & Spell. The data rate was about 1,000 bits per second. The video display employed in the Speak & Spell was a vacuum fluorescent display (VFD) that was only capable of displaying 8 text characters at a time. The later Super Speak & Spell model had a slimmer case and an LCD screen which could display 16 characters. The unit could use either 4 "C" batteries or 6-volt DC power adapter with positive tip polarity. Cartridges (also known as expansion modules) are freely exchangeable ROM libraries that provide additional content without providing additional functionality. These cartridges are plugged into

7452-423: The use of expansion module cartridges in consoles for which they were not designed. Since the layout of foreign editions is nearly identical (the only major differences being graphics, color, and placement of power/headset jacks), and the cartridges lacked a lockout, cartridges often bore instructions in multiple languages despite their designation for consumer groups that might not understand the language. In 1980,

7544-442: The user had a debugged program ready to be committed to production, it would send the program to Texas Instruments who would then make a special mask to program the on-chip ROM. The ROM could not be altered in the field; the contents were fixed by the patterns laid down on the chip by the manufacturer. While this process had a high initial cost, the production cost was very low, making it suitable for high volume products (say, more than

7636-487: The video game Deltarune . The Speak & Read was released in 1980 with a shape identical to the Speak & Spell but with different game features and a different color scheme. Where the American Speak & Spell had been colored red with yellow and orange accents, the American Speak & Read was yellow with blue and green accents. Game cartridges for the Speak & Read were identical in shape to those of

7728-527: The words was to have a professional speaker speak the words. The utterances were captured and processed. Originally all of the recording and processing was completed in Dallas. By 1982 when the British, French, Italian and German versions were being developed, the original voices were recorded in the TI facility near Nice in France and these full bit rate digital recordings were sent to Dallas for processing using

7820-516: Was a dedicated console and only one other version, the Speak & Write, was released for English markets. Speak & Spell Compact sales were very poor in the United States, causing TI to send much of its excess stock abroad. UK Marketing Manager Martin Finn had the product retitled for the UK, and all existing units were recolored blue and repackaged as "Speak & Write". In 1983, the Speak & Spell

7912-518: Was a subset of TI's Learning Center product group and the Speak & Spell was released simultaneously with the Spelling B (a non-speech product designed to help children learn to spell), and the First Watch (designed to teach children to read digital and analog timepieces). The Speak & Spell was sold, with regional variations, in the United States, the United Kingdom, and Japan. The toy

8004-412: Was again redesigned. The change was even more minute, however, representing nothing more substantial than a redesign of the faceplate graphics. This version was marketed first in Italian as Grillo Parlante ("The Talking Cricket " as the character of the book for children The Adventures of Pinocchio ), and then later in the United States and the United Kingdom as the Speak & Spell, and in France as

8096-431: Was also expanded and given more functions. The general structure of the console was also altered similarly to the Super Speak & Spell such that the handle which had come at the top of the screen in prior Speak & Math units was now found on the bottom of the toy and ergonomic features were added to the shape. Texas Instruments' Solid State Speech technology found its way into a number of other titles also related to

8188-558: Was completely recreated in 1982 as the Speak & Spell Compact (a version lacking a visual display), and in 1989 the Super Speak & Spell was released to replace the original vacuum fluorescent display (VFD) with a liquid crystal display (LCD). Between 1989 and 1992 the Super Speak & Spell saw three redesigns as well. The 1992 Super Speak & Spell marked the last release of the series. Regional variations with different speech libraries and different games were released in at least 9 countries with seven language variations. Because

8280-468: Was originally advertised as a tool for helping children ages 7 and up to learn to spell and pronounce over 200 commonly misspelled words. It shipped without a cartridge, in this configuration called simply the Basic Unit (containing the minigames Mystery Word , Secret Code , and Letter ). Between its release and 1983, the Speak & Spell was redesigned twice under the name Speak & Spell. It

8372-507: Was released in 1980 with a shape identical to both the Speak & Spell and the Speak & Read but with a completely different keyboard layout, different game features, and a different color scheme. Where the American Speak & Spell had been colored red with yellow and orange accents, the American Speak & Math was gray with blue and orange highlights. The Speak & Math was designed to focus on mathematics in children of ages 6–12 with

8464-463: Was well-suited to automated assembly equipment; a PCB could be populated with scores or hundreds of ICs, then all the components on the circuit board could be soldered at one time on a wave soldering machine and passed on to automated testing machines, with very little human labor required. DIP packages were still large with respect to the integrated circuits within them. By the end of the 20th century, surface-mount packages allowed further reduction in

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