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84-522: The Intellec computers were a series of early microcomputers Intel produced in the 1970s as a development platform for their processors. The Intellec computers were among the first microcomputers ever sold, predating the Altair 8800 by at least two years. The first series of Intellecs included the Intellec ;4 for the 4004 , the Intellec 4 Mod 40 for the 4040 , the Intellec 8 for

168-492: A design flow that engineers use to design, verify, and analyze entire semiconductor chips. Some of the latest EDA tools use artificial intelligence (AI) to help engineers save time and improve chip performance. Integrated circuits can be broadly classified into analog , digital and mixed signal , consisting of analog and digital signaling on the same IC. Digital integrated circuits can contain billions of logic gates , flip-flops , multiplexers , and other circuits in

252-627: A fabrication facility (commonly known as a semiconductor fab ) can cost over US$ 12 billion to construct. The cost of a fabrication facility rises over time because of increased complexity of new products; this is known as Rock's law . Such a facility features: ICs can be manufactured either in-house by integrated device manufacturers (IDMs) or using the foundry model . IDMs are vertically integrated companies (like Intel and Samsung ) that design, manufacture and sell their own ICs, and may offer design and/or manufacturing (foundry) services to other companies (the latter often to fabless companies ). In

336-412: A microprocessor will have memory on the chip. (See the regular array structure at the bottom of the first image. ) Although the structures are intricate – with widths which have been shrinking for decades – the layers remain much thinner than the device widths. The layers of material are fabricated much like a photographic process, although light waves in the visible spectrum cannot be used to "expose"

420-466: A common active area, but there was no electrical isolation to separate them from each other. The monolithic integrated circuit chip was enabled by the inventions of the planar process by Jean Hoerni and p–n junction isolation by Kurt Lehovec . Hoerni's invention was built on Carl Frosch and Lincoln Derick's work on surface protection and passivation by silicon dioxide masking and predeposition, as well as Fuller, Ditzenberger's and others work on

504-561: A common substrate in a three-stage amplifier arrangement. Jacobi disclosed small and cheap hearing aids as typical industrial applications of his patent. An immediate commercial use of his patent has not been reported. Another early proponent of the concept was Geoffrey Dummer (1909–2002), a radar scientist working for the Royal Radar Establishment of the British Ministry of Defence . Dummer presented

588-595: A computer based on a microprocessor – the Intel 8008 8-bit microprocessor. This Micral-N was marketed in early 1973 as a "Micro-ordinateur" or microcomputer , mainly for scientific and process-control applications. About a hundred Micral-N were installed in the next two years, followed by a new version based on the Intel 8080. Meanwhile, another French team developed the Alvan, a small computer for office automation which found clients in banks and other sectors. The first version

672-463: A computer had to be big in size to be powerful, and thus decided to market them as calculators. Additionally, at that time, people were more likely to buy calculators than computers, and, purchasing agents also preferred the term "calculator" because purchasing a "computer" required additional layers of purchasing authority approvals. The Datapoint 2200 , made by CTC in 1970, was also comparable to microcomputers. While it contains no microprocessor,

756-422: A disk operating system included in a series of programmable read-only memory chips (PROMs); 8 Kilobytes of RAM; IBM's Basic Assembly Language (BAL); a hard drive; a color display; a printer output; a 150 bit/s serial interface for connecting to a mainframe; and even the world's first microcomputer front panel. In early 1973, Sord Computer Corporation (now Toshiba Personal Computer System Corporation ) completed

840-689: A faster instruction cycle time of 10.8 us. Both systems were available in "Bare Bones" editions, which omitted the front panel, power supply, and completed chassis; instead, it is designed to mount into a rack. Both systems also weighed 14 kilograms (31 lb). Intel did not market the Intellec as a general-purpose microcomputer, but rather as a development system. As the first microprocessors were intended to run embedded systems such as in calculators , cash registers , scientific instrumentation , computer terminals , printers , plotters , industrial robots , synthesizers , game consoles , and so on,

924-491: A few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors , DSPs , and microcontrollers , use boolean algebra to process "one" and "zero" signals . Among the most advanced integrated circuits are the microprocessors or " cores ", used in personal computers, cell-phones, etc. Several cores may be integrated together in

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1008-428: A large transistor count . The IC's mass production capability, reliability, and building-block approach to integrated circuit design have ensured the rapid adoption of standardized ICs in place of designs using discrete transistors. ICs are now used in virtually all electronic equipment and have revolutionized the world of electronics . Computers, mobile phones, and other home appliances are now essential parts of

1092-408: A layer of material, as they would be too large for the features. Thus photons of higher frequencies (typically ultraviolet ) are used to create the patterns for each layer. Because each feature is so small, electron microscopes are essential tools for a process engineer who might be debugging a fabrication process. Each device is tested before packaging using automated test equipment (ATE), in

1176-419: A minicomputer or time-sharing service the opportunity to automate business functions, without (usually) hiring a full-time staff to operate the computers. A representative system of this era would have used an S100 bus , an 8-bit processor such as an Intel 8080 or Zilog Z80 , and either CP/M or MP/M operating system. The increasing availability and power of desktop computers for personal use attracted

1260-428: A number of steps for the p–n junction isolation of transistors on a chip, MOSFETs required no such steps but could be easily isolated from each other. Its advantage for integrated circuits was pointed out by Dawon Kahng in 1961. The list of IEEE milestones includes the first integrated circuit by Kilby in 1958, Hoerni's planar process and Noyce's planar IC in 1959. The earliest experimental MOS IC to be fabricated

1344-420: A process known as wafer testing , or wafer probing. The wafer is then cut into rectangular blocks, each of which is called a die . Each good die (plural dice , dies , or die ) is then connected into a package using aluminium (or gold) bond wires which are thermosonically bonded to pads , usually found around the edge of the die. Thermosonic bonding was first introduced by A. Coucoulas which provided

1428-421: A rate predicted by Moore's law , leading to large-scale integration (LSI) with hundreds of transistors on a single MOS chip by the late 1960s. Following the development of the self-aligned gate (silicon-gate) MOSFET by Robert Kerwin, Donald Klein and John Sarace at Bell Labs in 1967, the first silicon-gate MOS IC technology with self-aligned gates , the basis of all modern CMOS integrated circuits,

1512-407: A reliable means of forming these vital electrical connections to the outside world. After packaging, the devices go through final testing on the same or similar ATE used during wafer probing. Industrial CT scanning can also be used. Test cost can account for over 25% of the cost of fabrication on lower-cost products, but can be negligible on low-yielding, larger, or higher-cost devices. As of 2022 ,

1596-426: A semiconductor to modulate its electronic properties. Doping is the process of adding dopants to a semiconductor material. Since a CMOS device only draws current on the transition between logic states , CMOS devices consume much less current than bipolar junction transistor devices. A random-access memory is the most regular type of integrated circuit; the highest density devices are thus memories; but even

1680-859: A single IC or chip. Digital memory chips and application-specific integrated circuits (ASICs) are examples of other families of integrated circuits. In the 1980s, programmable logic devices were developed. These devices contain circuits whose logical function and connectivity can be programmed by the user, rather than being fixed by the integrated circuit manufacturer. This allows a chip to be programmed to do various LSI-type functions such as logic gates , adders and registers . Programmability comes in various forms – devices that can be programmed only once , devices that can be erased and then re-programmed using UV light , devices that can be (re)programmed using flash memory , and field-programmable gate arrays (FPGAs) which can be programmed at any time, including during operation. Current FPGAs can (as of 2016) implement

1764-532: A single die. A technique has been demonstrated to include microfluidic cooling on integrated circuits, to improve cooling performance as well as peltier thermoelectric coolers on solder bumps, or thermal solder bumps used exclusively for heat dissipation, used in flip-chip . The cost of designing and developing a complex integrated circuit is quite high, normally in the multiple tens of millions of dollars. Therefore, it only makes economic sense to produce integrated circuit products with high production volume, so

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1848-495: A single layer on one side of a chip of silicon in a flat two-dimensional planar process . Researchers have produced prototypes of several promising alternatives, such as: As it becomes more difficult to manufacture ever smaller transistors, companies are using multi-chip modules / chiplets , three-dimensional integrated circuits , package on package , High Bandwidth Memory and through-silicon vias with die stacking to increase performance and reduce size, without having to reduce

1932-486: A six-pin device. Radios with the Loewe 3NF were less expensive than other radios, showing one of the advantages of integration over using discrete components , that would be seen decades later with ICs. Early concepts of an integrated circuit go back to 1949, when German engineer Werner Jacobi ( Siemens AG ) filed a patent for an integrated-circuit-like semiconductor amplifying device showing five transistors on

2016-512: A small piece of semiconductor material, usually silicon . Integrated circuits are used in a wide range of electronic devices, including computers , smartphones , and televisions , to perform various functions such as processing and storing information. They have greatly impacted the field of electronics by enabling device miniaturization and enhanced functionality. Integrated circuits are orders of magnitude smaller, faster, and less expensive than those constructed of discrete components, allowing

2100-632: A solid state machine designed with a microprocessor. In the US the earliest models such as the Altair 8800 were often sold as kits to be assembled by the user, and came with as little as 256 bytes of RAM , and no input/output devices other than indicator lights and switches, useful as a proof of concept to demonstrate what such a simple device could do. As microprocessors and semiconductor memory became less expensive, microcomputers grew cheaper and easier to use. All these improvements in cost and usability resulted in an explosion in their popularity during

2184-557: A time, although they can often be modified with software or hardware to concurrently serve more than one user. Microcomputers fit well on or under desks or tables, so that they are within easy access of users. Bigger computers like minicomputers , mainframes , and supercomputers take up large cabinets or even dedicated rooms. A microcomputer comes equipped with at least one type of data storage, usually RAM . Although some microcomputers (particularly early 8-bit home micros) perform tasks using RAM alone, some form of secondary storage

2268-505: A year after Kilby, Robert Noyce at Fairchild Semiconductor invented the first true monolithic IC chip. More practical than Kilby's implementation, Noyce's chip was made of silicon , whereas Kilby's was made of germanium , and Noyce's was fabricated using the planar process , developed in early 1959 by his colleague Jean Hoerni and included the critical on-chip aluminum interconnecting lines. Modern IC chips are based on Noyce's monolithic IC, rather than Kilby's. NASA's Apollo Program

2352-434: Is able to address up to 16 K of memory and came with 5 K pre-installed. The Intellec 4 came with 1 K of PROM and 4 K of RAM for instruction memory, as well as 320 4-bit words of data memory, expandable to 2560 words. The Intellec 8 ran with a two-phase clock of 800 kHz, resulting in an instruction cycle time of 12.5 us. The Intellec 4 ran at a slower clock rate of 750 kHz, but had

2436-447: Is low because the chips, with all their components, are printed as a unit by photolithography rather than being constructed one transistor at a time. Furthermore, packaged ICs use much less material than discrete circuits. Performance is high because the IC's components switch quickly and consume comparatively little power because of their small size and proximity. The main disadvantage of ICs

2520-806: Is normally desirable. In the early days of home micros, this was often a data cassette deck (in many cases as an external unit). Later, secondary storage (particularly in the form of floppy disk and hard disk drives) were built into the microcomputer case. Although they did not contain any microprocessors, but were built around transistor-transistor logic (TTL), Hewlett-Packard calculators as far back as 1968 had various levels of programmability comparable to microcomputers. The HP 9100B (1968) had rudimentary conditional (if) statements, statement line numbers, jump statements ( go to ), registers that could be used as variables, and primitive subroutines. The programming language resembled assembly language in many ways. Later models incrementally added more features, including

2604-690: Is obsolete. An early attempt at combining several components in one device (like modern ICs) was the Loewe 3NF vacuum tube first made in 1926. Unlike ICs, it was designed with the purpose of tax avoidance , as in Germany, radio receivers had a tax that was levied depending on how many tube holders a radio receiver had. It allowed radio receivers to have a single tube holder. One million were manufactured, and were "a first step in integration of radioelectronic devices". The device contained an amplifier , composed of three triodes, two capacitors and four resistors in

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2688-534: Is sometimes called the first generation of microcomputers. Many companies such as DEC , National Semiconductor , Texas Instruments offered their microcomputers for use in terminal control, peripheral device interface control and industrial machine control. There were also machines for engineering development and hobbyist personal use. In 1975, the Processor Technology SOL-20 was designed, which consisted of one board which included all

2772-413: Is the high initial cost of designing them and the enormous capital cost of factory construction. This high initial cost means ICs are only commercially viable when high production volumes are anticipated. An integrated circuit is defined as: A circuit in which all or some of the circuit elements are inseparably associated and electrically interconnected so that it is considered to be indivisible for

2856-625: The 8008 , and the Intellec 8 Mod 80 for the 8080 . The Intellec 4 and 8 were introduced at the June 1973 National Computer Conference in the New York Coliseum . The Intellec computers were sold not to the general public, only to developers, and a very limited number were built. The Intellec 8 retailed for $ 2,395. The Intellecs have resident monitors stored in ROMs . They also included an assembler, linker, and debugger, as well as

2940-450: The BASIC programming language (HP 9830A in 1971). Some models had tape storage and small printers. However, displays were limited to one line at a time. The HP 9100A was referred to as a personal computer in an advertisement in a 1968 Science magazine, but that advertisement was quickly dropped. HP was reluctant to sell them as "computers" because the perception at that time was that

3024-476: The dual in-line package (DIP), first in ceramic and later in plastic, which is commonly cresol - formaldehyde - novolac . In the 1980s pin counts of VLSI circuits exceeded the practical limit for DIP packaging, leading to pin grid array (PGA) and leadless chip carrier (LCC) packages. Surface mount packaging appeared in the early 1980s and became popular in the late 1980s, using finer lead pitch with leads formed as either gull-wing or J-lead, as exemplified by

3108-566: The instruction set of its custom TTL processor was the basis of the instruction set for the Intel 8008 , and for practical purposes the system behaves approximately as if it contains an 8008. This is because Intel was the contractor in charge of developing the Datapoint's CPU, but ultimately CTC rejected the 8008 design because it needed 20 support chips. Another early system, the Kenbak-1 ,

3192-488: The non-recurring engineering (NRE) costs are spread across typically millions of production units. Modern semiconductor chips have billions of components, and are far too complex to be designed by hand. Software tools to help the designer are essential. Electronic design automation (EDA), also referred to as electronic computer-aided design (ECAD), is a category of software tools for designing electronic systems , including integrated circuits. The tools work together in

3276-498: The periodic table of the chemical elements were identified as the most likely materials for a solid-state vacuum tube . Starting with copper oxide , proceeding to germanium , then silicon , the materials were systematically studied in the 1940s and 1950s. Today, monocrystalline silicon is the main substrate used for ICs although some III-V compounds of the periodic table such as gallium arsenide are used for specialized applications like LEDs , lasers , solar cells and

3360-544: The small-outline integrated circuit (SOIC) package – a carrier which occupies an area about 30–50% less than an equivalent DIP and is typically 70% thinner. This package has "gull wing" leads protruding from the two long sides and a lead spacing of 0.050 inches. In the late 1990s, plastic quad flat pack (PQFP) and thin small-outline package (TSOP) packages became the most common for high pin count devices, though PGA packages are still used for high-end microprocessors . Ball grid array (BGA) packages have existed since

3444-416: The switching power consumption per transistor goes down, while the memory capacity and speed go up, through the relationships defined by Dennard scaling ( MOSFET scaling ). Because speed, capacity, and power consumption gains are apparent to the end user, there is fierce competition among the manufacturers to use finer geometries. Over the years, transistor sizes have decreased from tens of microns in

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3528-503: The very large-scale integration (VLSI) of more than 10,000 transistors on a single chip. At first, MOS-based computers only made sense when high density was required, such as aerospace and pocket calculators . Computers built entirely from TTL, such as the 1970 Datapoint 2200 , were much faster and more powerful than single-chip MOS microprocessors such as the 1972 Intel 8008 until the early 1980s. Advances in IC technology, primarily smaller features and larger chips, have allowed

3612-425: The 1970s. Flip-chip Ball Grid Array packages, which allow for a much higher pin count than other package types, were developed in the 1990s. In an FCBGA package, the die is mounted upside-down (flipped) and connects to the package balls via a package substrate that is similar to a printed-circuit board rather than by wires. FCBGA packages allow an array of input-output signals (called Area-I/O) to be distributed over

3696-482: The 22 nm node (Intel) or 16/14 nm nodes. Mono-crystal silicon wafers are used in most applications (or for special applications, other semiconductors such as gallium arsenide are used). The wafer need not be entirely silicon. Photolithography is used to mark different areas of the substrate to be doped or to have polysilicon, insulators or metal (typically aluminium or copper) tracks deposited on them. Dopants are impurities intentionally introduced to

3780-549: The Altair itself was only a mild commercial success, it helped spark a huge industry. By 1977, the introduction of the second microcomputer generation as consumer goods , known as home computers , made them considerably easier to use than their predecessors because their predecessors' operation often demanded thorough familiarity with practical electronics. The ability to connect to a monitor (screen) or TV set allowed visual manipulation of text and numbers. The BASIC language, which

3864-623: The IBM PC itself was widely imitated, as well as the term. The component parts were commonly available to producers and the BIOS was reverse engineered through cleanroom design techniques. IBM PC compatible "clones" became commonplace, and the terms "personal computer", and especially "PC", stuck with the general public, often specifically for a computer compatible with DOS (or nowadays Windows). Monitors, keyboards and other devices for input and output may be integrated or separate. Computer memory in

3948-406: The Intellec microcomputer development system as a system for developing other OEM microcomputers. This microcomputer - or microprocessor -related article is a stub . You can help Misplaced Pages by expanding it . Microcomputer The abbreviation "micro" was common during the 1970s and 1980s, but has since fallen out of common usage. The term microcomputer came into popular use after

4032-467: The Intellec was used for programming programmable memory chips used by embedded systems, e.g. the 2048- bit (256- byte ) Intel 1602A programmable read-only memory (PROM) or erasable 1702A EPROM chips which were plugged into a ZIF socket on the Intellec-8's front panel . The chip-programming socket is the green device in the lower right corner of the Intellec's front panel. Intel also marketed

4116-702: The SMP80/08, which used the Intel 8008 microprocessor. The SMP80/08, however, did not have a commercial release. After the first general-purpose microprocessor, the Intel 8080 , was announced in April 1974, Sord announced the SMP80/x, the first microcomputer to use the 8080, in May 1974. Virtually all early microcomputers were essentially boxes with lights and switches; one had to read and understand binary numbers and machine language to program and use them (the Datapoint 2200

4200-399: The ability to act as an in-circuit emulator. Additionally, a PL/M compiler, cross-assembler and simulator were available, which allowed writing programs in a higher-level language than assembly. FORTRAN compilers were also available. The Intellec 8 supported a Teletype operating at 110 baud , a high speed punched paper tape reader and a CRT terminal at 1200 baud. The Intellec 8

4284-439: The attention of more software developers. As the industry matured, the market for personal computers standardized around IBM PC compatibles running DOS , and later Windows . Modern desktop computers, video game consoles , laptops , tablet PCs , and many types of handheld devices , including mobile phones , pocket calculators , and industrial embedded systems , may all be considered examples of microcomputers according to

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4368-479: The components of the electronic circuit are completely integrated". The first customer for the new invention was the US Air Force . Kilby won the 2000 Nobel Prize in physics for his part in the invention of the integrated circuit. However, Kilby's invention was not a true monolithic integrated circuit chip since it had external gold-wire connections, which would have made it difficult to mass-produce. Half

4452-520: The definition given above. By the early 2000s, everyday use of the expression "microcomputer" (and in particular "micro") declined significantly from its peak in the mid-1980s. The term is most commonly associated with the most popular 8-bit home computers (such as the Apple II , ZX Spectrum , Commodore 64 , BBC Micro , and TRS-80 ) and small-business CP/M -based microcomputers. In colloquial usage, "microcomputer" has been largely supplanted by

4536-473: The desktop Datapoint 2200 were built from bipolar integrated circuits, either TTL or the even faster emitter-coupled logic (ECL). Nearly all modern IC chips are metal–oxide–semiconductor (MOS) integrated circuits, built from MOSFETs (metal–oxide–silicon field-effect transistors). The MOSFET invented at Bell Labs between 1955 and 1960, made it possible to build high-density integrated circuits . In contrast to bipolar transistors which required

4620-418: The die must pass through the material electrically connecting the die to the package, through the conductive traces (paths) in the package, through the leads connecting the package to the conductive traces on the printed circuit board . The materials and structures used in the path these electrical signals must travel have very different electrical properties, compared to those that travel to different parts of

4704-541: The diffusion of impurities into silicon. A precursor idea to the IC was to create small ceramic substrates (so-called micromodules ), each containing a single miniaturized component. Components could then be integrated and wired into a bidimensional or tridimensional compact grid. This idea, which seemed very promising in 1957, was proposed to the US Army by Jack Kilby and led to the short-lived Micromodule Program (similar to 1951's Project Tinkertoy). However, as

4788-537: The early 1970s to 10 nanometers in 2017 with a corresponding million-fold increase in transistors per unit area. As of 2016, typical chip areas range from a few square millimeters to around 600 mm , with up to 25 million transistors per mm . The expected shrinking of feature sizes and the needed progress in related areas was forecast for many years by the International Technology Roadmap for Semiconductors (ITRS). The final ITRS

4872-541: The entire die rather than being confined to the die periphery. BGA devices have the advantage of not needing a dedicated socket but are much harder to replace in case of device failure. Intel transitioned away from PGA to land grid array (LGA) and BGA beginning in 2004, with the last PGA socket released in 2014 for mobile platforms. As of 2018 , AMD uses PGA packages on mainstream desktop processors, BGA packages on mobile processors, and high-end desktop and server microprocessors use LGA packages. Electrical signals leaving

4956-580: The equivalent of millions of gates and operate at frequencies up to 1 GHz . Analog ICs, such as sensors , power management circuits , and operational amplifiers (op-amps), process continuous signals , and perform analog functions such as amplification , active filtering , demodulation , and mixing . ICs can combine analog and digital circuits on a chip to create functions such as analog-to-digital converters and digital-to-analog converters . Such mixed-signal circuits offer smaller size and lower cost, but must account for signal interference. Prior to

5040-501: The form of RAM , and at least one other less volatile, memory storage device are usually combined with the CPU on a system bus in one unit. Other devices that make up a complete microcomputer system include batteries, a power supply unit, a keyboard and various input/output devices used to convey information to and from a human operator ( printers , monitors , human interface devices ). Microcomputers are designed to serve only one user at

5124-412: The foundry model, fabless companies (like Nvidia ) only design and sell ICs and outsource all manufacturing to pure play foundries such as TSMC . These foundries may offer IC design services. The earliest integrated circuits were packaged in ceramic flat packs , which continued to be used by the military for their reliability and small size for many years. Commercial circuit packaging quickly moved to

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5208-568: The highest-speed integrated circuits. It took decades to perfect methods of creating crystals with minimal defects in semiconducting materials' crystal structure . Semiconductor ICs are fabricated in a planar process which includes three key process steps – photolithography , deposition (such as chemical vapor deposition ), and etching . The main process steps are supplemented by doping and cleaning. More recent or high-performance ICs may instead use multi-gate FinFET or GAAFET transistors instead of planar ones, starting at

5292-602: The idea to the public at the Symposium on Progress in Quality Electronic Components in Washington, D.C. , on 7 May 1952. He gave many symposia publicly to propagate his ideas and unsuccessfully attempted to build such a circuit in 1956. Between 1953 and 1957, Sidney Darlington and Yasuo Tarui ( Electrotechnical Laboratory ) proposed similar chip designs where several transistors could share

5376-629: The introduction of the minicomputer , although Isaac Asimov used the term in his short story " The Dying Night " as early as 1956 (published in The Magazine of Fantasy and Science Fiction in July that year). Most notably, the microcomputer replaced the many separate components that made up the minicomputer's CPU with one integrated microprocessor chip . In 1973, the French Institut National de la Recherche Agronomique (INRA)

5460-581: The late 1970s and early 1980s. A large number of computer makers packaged microcomputers for use in small business applications. By 1979, many companies such as Cromemco , Processor Technology , IMSAI , North Star Computers , Southwest Technical Products Corporation , Ohio Scientific , Altos Computer Systems , Morrow Designs and others produced systems designed for resourceful end users or consulting firms to deliver business systems such as accounting, database management and word processing to small businesses. This allowed businesses unable to afford leasing of

5544-421: The late 1990s, radios could not be fabricated in the same low-cost CMOS processes as microprocessors. But since 1998, radio chips have been developed using RF CMOS processes. Examples include Intel's DECT cordless phone, or 802.11 ( Wi-Fi ) chips created by Atheros and other companies. Modern electronic component distributors often further sub-categorize integrated circuits: The semiconductors of

5628-433: The number of MOS transistors in an integrated circuit to double every two years, a trend known as Moore's law. Moore originally stated it would double every year, but he went on to change the claim to every two years in 1975. This increased capacity has been used to decrease cost and increase functionality. In general, as the feature size shrinks, almost every aspect of an IC's operation improves. The cost per transistor and

5712-468: The parts of the computer system. The SOL-20 had built-in EPROM software which eliminated the need for rows of switches and lights. The MITS Altair just mentioned played an instrumental role in sparking significant hobbyist interest, which itself eventually led to the founding and success of many well-known personal computer hardware and software companies, such as Microsoft and Apple Computer . Although

5796-446: The project was gaining momentum, Kilby came up with a new, revolutionary design: the IC. Newly employed by Texas Instruments , Kilby recorded his initial ideas concerning the integrated circuit in July 1958, successfully demonstrating the first working example of an integrated circuit on 12 September 1958. In his patent application of 6 February 1959, Kilby described his new device as "a body of semiconductor material … wherein all

5880-592: The purposes of construction and commerce. In strict usage, integrated circuit refers to the single-piece circuit construction originally known as a monolithic integrated circuit , which comprises a single piece of silicon. In general usage, circuits not meeting this strict definition are sometimes referred to as ICs, which are constructed using many different technologies, e.g. 3D IC , 2.5D IC , MCM , thin-film transistors , thick-film technologies , or hybrid integrated circuits . The choice of terminology frequently appears in discussions related to whether Moore's Law

5964-449: The same size – a modern chip may have many billions of transistors in an area the size of a human fingernail. These advances, roughly following Moore's law , make the computer chips of today possess millions of times the capacity and thousands of times the speed of the computer chips of the early 1970s. ICs have three main advantages over circuits constructed out of discrete components: size, cost and performance. The size and cost

6048-474: The size of the transistors. Such techniques are collectively known as advanced packaging . Advanced packaging is mainly divided into 2.5D and 3D packaging. 2.5D describes approaches such as multi-chip modules while 3D describes approaches where dies are stacked in one way or another, such as package on package and high bandwidth memory. All approaches involve 2 or more dies in a single package. Alternatively, approaches such as 3D NAND stack multiple layers on

6132-445: The structure of modern societies, made possible by the small size and low cost of ICs such as modern computer processors and microcontrollers . Very-large-scale integration was made practical by technological advancements in semiconductor device fabrication . Since their origins in the 1960s, the size, speed, and capacity of chips have progressed enormously, driven by technical advances that fit more and more transistors on chips of

6216-434: The term personal computer became generally used for microcomputers compatible with the IBM PC architecture ( IBM PC–compatible ). Integrated circuit An integrated circuit ( IC ), also known as a microchip , computer chip , or simply chip , is a small electronic device made up of multiple interconnected electronic components such as transistors , resistors , and capacitors . These components are etched onto

6300-452: The term " personal computer " or "PC", which specifies a computer that has been designed to be used by one individual at a time, a term first coined in 1959. IBM first promoted the term "personal computer" to differentiate the IBM PC from CP/M -based microcomputers likewise targeted at the small-business market, and also IBM's own mainframes and minicomputers. However, following its release,

6384-401: Was a 16-transistor chip built by Fred Heiman and Steven Hofstein at RCA in 1962. General Microelectronics later introduced the first commercial MOS integrated circuit in 1964, a 120-transistor shift register developed by Robert Norman. By 1964, MOS chips had reached higher transistor density and lower manufacturing costs than bipolar chips. MOS chips further increased in complexity at

6468-493: Was a striking exception, bearing a modern design based on a monitor, keyboard, and tape and disk drives). Of the early "box of switches"-type microcomputers, the MITS Altair 8800 (1975) was arguably the most famous. Most of these simple, early microcomputers were sold as electronic kits —bags full of loose components which the buyer had to solder together before the system could be used. The period from about 1971 to 1976

6552-535: Was based on LSI chips with an Intel 8008 as peripheral controller (keyboard, monitor and printer), before adopting the Zilog Z80 as main processor. In late 1972, a Sacramento State University team led by Bill Pentz built the Sac State 8008 computer, able to handle thousands of patients' medical records. The Sac State 8008 was designed with the Intel 8008. It had a full set of hardware and software components :

6636-441: Was developed at Fairchild Semiconductor by Federico Faggin in 1968. The application of MOS LSI chips to computing was the basis for the first microprocessors , as engineers began recognizing that a complete computer processor could be contained on a single MOS LSI chip. This led to the inventions of the microprocessor and the microcontroller by the early 1970s. During the early 1970s, MOS integrated circuit technology enabled

6720-474: Was easier to learn and use than raw machine language, became a standard feature. These features were already common in minicomputers , with which many hobbyists and early produces were familiar. In 1979, the launch of the VisiCalc spreadsheet (initially for the Apple II ) first turned the microcomputer from a hobby for computer enthusiasts into a business tool. After the 1981 release by IBM of its IBM PC ,

6804-514: Was issued in 2016, and it is being replaced by the International Roadmap for Devices and Systems . Initially, ICs were strictly electronic devices. The success of ICs has led to the integration of other technologies, in an attempt to obtain the same advantages of small size and low cost. These technologies include mechanical devices, optics, and sensors. As of 2018 , the vast majority of all transistors are MOSFETs fabricated in

6888-479: Was looking for a computer able to measure agricultural hygrometry . To answer this request, a team of French engineers of the computer technology company R2E, led by its Head of Development, François Gernelle , created the first available microprocessor-based microcomputer, the Micral N. The same year the company filed their patents with the term "Micro-ordinateur", a literal equivalent of "Microcomputer", to designate

6972-429: Was released in 1971. Like the Datapoint 2200, it used small-scale integrated transistor–transistor logic instead of a microprocessor. It was marketed as an educational and hobbyist tool, but it was not a commercial success; production ceased shortly after introduction. In late 1972, a French team headed by François Gernelle within a small company, Réalisations & Etudes Electroniques (R2E), developed and patented

7056-480: Was the largest single consumer of integrated circuits between 1961 and 1965. Transistor–transistor logic (TTL) was developed by James L. Buie in the early 1960s at TRW Inc. TTL became the dominant integrated circuit technology during the 1970s to early 1980s. Dozens of TTL integrated circuits were a standard method of construction for the processors of minicomputers and mainframe computers . Computers such as IBM 360 mainframes, PDP-11 minicomputers and

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